Stan, G.
, King, S.
and Cook, R.
(2009),
Elastic modulus of low-k dielectric thin films measured by load-dependent contact-resonance atomic force microscopy, Journal of Materials Research, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=902329
(Accessed January 30, 2025)
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Elastic modulus of low-k dielectric thin films measured by load-dependent contact-resonance atomic force microscopy
Published
Author(s)
, Sean King,
Abstract
Correlated force and contact-resonance versus displacement responses have been resolved using load-dependent contact-resonance atomic force microscopy (AFM) to determine the elastic modulus of low-k dielectric thin films. The measurements consisted of recording simultaneously both the deflection and resonance frequency shift of an AFM cantilever-probe as the probe was gradually brought in and out of contact. As the applied forces were restricted to the range of adhesive forces, low-k dielectric films of elastic modulus varying from GPa to hundreds of GPa were measurable in this investigation. Over this elastic modulus range, the reliability of load-dependent contactresonance AFM measurements was confirmed by comparing these results with that from picosecond laser acoustics measurements.Citation
Journal of Materials Research
Volume
24
Issue
9
Pub Type
Journals
Download Paper
Keywords
nanomechanical properties, atomic force microscopy, low-k dielectric films
Citation
Issues
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Created September 14, 2009, Updated February 19, 2017