U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

PUBLICATIONS

Global Convergence on a Single Lead-Free Solder Alloy: Transitioning to Pb-Free Assemblies

Published

Author(s)

C A. Handwerker

Abstract

This article discusses the dominant Pb-free alloy system used worldwide and its assembly behavior when Pb-free and Sn-Pb alloys and processes are mixed and the effects on the structure and properties of the as-solidified solder joints. The conditions under which Sn-Pb pastes, solder baths, and processes form reliable joints with Sn-Ag-Cu surface finishes on components and boards is referred to as backward compatibility. Likewise, during the transition to completely Pb-free assemblies, the conditions for forward compatibility are found when Sn-Ag-Cu pastes, solder baths and processes form reliable joints when used with Sn-Pb surface finishes on components
Citation
Circuits Assembly
Pub Type
Journals

Keywords

circuit boards assembly, electronic packaging, lead-free solder, Pb-free, RoHS, WEEE

Citation

Handwerker, C. (2008), Global Convergence on a Single Lead-Free Solder Alloy: Transitioning to Pb-Free Assemblies, Circuits Assembly (Accessed November 8, 2024)

Issues

If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.

Created October 16, 2008