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Displaying 451 - 475 of 718

Noise-Parameter Uncertainties: A Monte Carlo Simulation

October 1, 2002
Author(s)
James P. Randa
This paper reports the formulation and results of a Monte Carlo study of uncertainties in noise-parameter measurements. The simulator permits the computation of the dependence of the uncertainty in the noise parameters on uncertainties in the underlying

A Monolithic Implementation of Interface Circuitry for CMOS Compatible Gas-Sensor System

July 1, 2002
Author(s)
Muhammad Afridi, John S. Suehle, Mona E. Zaghloul, David W. Berning, Allen R. Hefner Jr., Stephen Semancik, Richard E. Cavicchi
A monolithic CMOS micro-gas-sensor system, designed and fabricated in a standard CMOS process, is described. The gas-sensor system incorporates an array of four microhotplate-based gas-sensing structures. The system utilizes a thin film of tin-oxide (SnO 2

Simulations of Noise-Parameter Uncertainties

June 7, 2002
Author(s)
James P. Randa
This paper reports results for uncertainties obtained using a Monte Carlo simulation of noise-parameter measurements. The simulator permits the computation of the dependence of the uncertainty in the noise parameters on uncertainties in the underlying

Vector Corrected Noise Temperature Measurements

June 7, 2002
Author(s)
Mark H. Weatherspoon, Lawrence P. Dunleavy, Ali Boudiaf, James P. Randa
A new one-port noise temperature measurement technique is presented that uses receiver noise parameters for error correction. Improved accuracy in one-port noise temperature measurements made with commercial systems is demonstrated without using isolators

Transient Heating Study of Microhotplates by Using a High-Speed Thermal Imaging System

March 1, 2002
Author(s)
Muhammad Afridi, David W. Berning, Allen R. Hefner Jr., John S. Suehle, Mona E. Zaghloul, Eric Kelley, Zharadeen R. Parrilla, Colleen E. Hood
A high-speed thermal imaging system is used to investigate the dynamic thermal behavior of MEMS-based (MicroElectroMechanical Systems) microhotplate devices. These devices are suspended microstructures fabricated in CMOS technology and are used in various

Foreword for Motohisa Kanda's Special Issue

February 1, 2002
Author(s)
Christopher L. Holloway, Perry F. Wilson
This special issue of the IEEE EMC Transactions is in honor of Dr. Motohisa Kanda who passed away on June 12, 2000. Dr. Kanda, known to most of us simply as "Moto," was an important figure within the EMC community and served as Editor of the IEEE EMC

Characterization and Modeling of Silicon-Carbide Power Devices

December 1, 2001
Author(s)
Allen R. Hefner Jr., David W. Berning, Ty R. McNutt, Alan Mantooth, Jih-Sheng Lai, Ranbir Singh
New Power semiconductor devices have begun to emerge that utilize the advantages of silicon carbide (SiC). As SiC power device types are introduced, circuit performance and reliability characterization are required for system designers to adopt the new

Noise Parameter Uncertainties from Monte Carlo Simulations

November 8, 2001
Author(s)
James P. Randa, Wojciech Wiatr
We present results for uncertainties in noise-parameter measurements, obtained using a Monte Carlo simulation of the measurements. Sets of data were generated to simulate measurements on a low-noise amplifier, with given uncertainties in the underlying

Noise Characterization of Multiport Amplifiers

October 1, 2001
Author(s)
James P. Randa
I address the issue of the definition and measurement of noise figure and parameters to characterize multiport devices, particularly differential amplifiers. A parameterization in terms of the noise matrix appears to be the most practical. the noise figure

Meander Delay Line Challenge Problem: A Comparison Using FDTD, FEM and MOM Techniques

August 13, 2001
Author(s)
Alpesh Bhobe, Christopher L. Holloway, Melinda Piket-May
Full wave finite-difference time-domain (FDTD) and a simplified 1D- finite-difference time-domain technique using the multi-conductor transmission line equations are applied to a delay line to determine its propagation characteristics. The output volatge

High Temperature Characteristics of 5kV, 20 A 4H-SiC PiN Rectifiers

June 7, 2001
Author(s)
Ranbir Singh, Allen R. Hefner Jr., David W. Berning, M. Palmer
This paper reports in detail, the design, a manufactuable fabrication process, and high temperature characteristics of a 4H-SiC rectifier with a 5 kV, 20 A rating. A highly doped p-type epitaxial Anode layer and junction termination extension (JTE) were

Use of the Oscillation Based Built-in Self-test Method for Smart Sensor Devices

May 7, 2001
Author(s)
Angela Hodge, R. Newcomb, Allen R. Hefner Jr.
An oscillation-based built in self-test (BIST) method is presented for functional testing of mixed signal devices. An integral component of this method of on-chip testing involves transforming an oscillating analog signal into a digital clock-like signal

A High-Speed Thermal Imaging System for Semiconductor Device Analysis

April 1, 2001
Author(s)
Allen R. Hefner Jr., David W. Berning, David L. Blackburn, Christophe C. Chapuy, Sebastien Bouche
A new high-speed transient thermal imaging system is presented that provides the capability to measure the transient temperature distributions on the surface of a silicon chip with 1 υs time, and 15 υm spatial resolution. The system uses virtual instrument
Displaying 451 - 475 of 718