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Displaying 1301 - 1325 of 2125

Industry Case Studies in the Use of Immersive Virtual Assembly

April 1, 2007
Author(s)
Sankar Jayaram, Uma Jayaram, Young J. Kim, Charles Dechenne, Kevin W. Lyons, Craig Palmer, Tatsuki Mitsui
In this paper we report on two engineering case studies that have been conducted as part of a Virtual Assembly Technology Consortium. The objectives of the case studies were to determine if immersive virtual assembly capabilities allow industry assembly

An Athena Validation Pilot Showcase for Automotive Industry

March 12, 2007
Author(s)
Nenad Ivezic, Pat Snack
The Automotive Industry Action Group- (AIAG) led consortium, formed to execute an ATHENA project validation pilot, demonstrated initial results at the AIAG Enterprise Interoperability Showcase on November 15 in Detroit, Michigan. As the basis of the ATHENA

Application of Carbon Nanotube Probes in a Critical Dimension Atomic Force Microscope

March 1, 2007
Author(s)
B C. Park, J Choi, S J. Ahn, D H. Kim, L Joon, Ronald G. Dixson, Ndubuisi George Orji, Joseph Fu, Theodore V. Vorburger
The ever decreasing size of semiconductor features demands the advancement of critical dimension atomic force microscope (CD-AFM) technology, for which the fabrication and use of more ideal probes like carbon nanotubes (CNT) is of considerable interest

The Architecture Development Facilitator (ADF) First Year Report

March 1, 2007
Author(s)
Steven J. Fenves, Eswaran Subrahmanian, Puja Goyal, Jean-Cyrus L. Angbo, Faouzi Daoud, Ram D. Sriram
This document serves as the summary report on the first year?s progress on the Architecture Development Facilitator (ADF) project covering the activities from December 15, 2005, to December 15, 2006. The ADF is intended to assist the Office of Network

The Coming of Age of Tilt CD-SEM

March 1, 2007
Author(s)
B Bunday, J Allgair, E Solecky, C Archie, Ndubuisi George Orji
The need for 3D metrology is becoming more urgent to address critical gaps in metrology for both lithographic and etch processes. Current generation lithographic processing (ArF source, where lambda=193 nm) sometimes results in photoresist lines with re

Zero-Order Imaging of Device-Sized Overlay Targets Using Scatterfield Microscopy

March 1, 2007
Author(s)
Bryan M. Barnes, Lowell P. Howard, P Lipscomb, Richard M. Silver
Patterns of lines and trenches with nominal linewidths of 50 nm have been proposed for use as an overlay target appropriate for placement inside the patterned wafer die. The NIST Scatterfield Targets feature groupings of eight lines and/or trenches which

Accuracy in Optical Image Modeling

February 26, 2007
Author(s)
James E. Potzick, Egon Marx, M P. Davidson
Wafer exposure process simulation and optical photomask feature metrology both rely on optical image modeling for accurate results. The best way to gauge the accuracy of an imaging model is to compare the model results with an actual image. Modeling

MOSS - Material Off-Shore Sourcing

February 13, 2007
Author(s)
Peter O. Denno
The Automotive Industry Action Group (AIAG) Project, Customs / Logistics Strategies to Strengthen Long Distance Supply Chains, seeks to improve processes and information communication employed in intercontinental trade lanes. At the time this paper was

A Case Study in Enterprise Modelling for Interoperable Cross-Enterprise Data Exchange

February 1, 2007
Author(s)
Marija Jankovic, Nenad Ivezic, T Knothe, Zuran Marjanovic, Pat Snack
In this paper, we describe an approach to validate the capability of the ATHENA-enhanced enterprise modelling solutions to capture necessary cross-organizational business information in a computable form and to exchange partial models using a proposed

Computational Models of the Nana Probe Tip for Static Behaviors (Abstract Only)

February 1, 2007
Author(s)
Shaw C. Feng, Theodore V. Vorburger, Che B. Joung, Joseph Fu, Ronald G. Dixson, Li Ma
As integrated circuits become smaller and faster, the measurement of line width must have less uncertainty and more versatility. The common requirement for uncertainty is less than 10 nanometers. The industrial need for versatility is three dimensional

NIST Focuses Attention on Clinical Informatics and Healthcare IT Standards

February 1, 2007
Author(s)
Sharon J. Kemmerer
NIST has recently established an institutional membership with the Health Industy Business Communication Council (HIBCC) - the ANSI-accredited standards development organization. HIBCC featured a welcoming article in their Sept-Dec 2005 magazine that

On Capturing Information Requirements in Process Specifications

February 1, 2007
Author(s)
Edward J. Barkmeyer Jr., Peter O. Denno
Historically, business process models refer only to large information sets, and database models and messaging standards provide models of all information about the related business entities that might be used in any of several business processes. In short

Manufacture and Metrology of 300 mm Silicon Wafers with Ultra-Low Thickness Variations

January 2, 2007
Author(s)
Ulf Griesmann, Quandou (. Wang, Marc Tricard, Paul Dumas, Christopher Hill
With the evolution of exposure tools for optical lithography towards larger numerical apertures, the semiconductor industry expects continued demand for improved wafer flatness at the exposure site. The Allowable site flatness for 300 mm wafers is expected

3D Image Correction of Tilted Sample Through Coordinate Transformation

January 1, 2007
Author(s)
Wei Chu, Joseph Fu, Ronald G. Dixson, Theodore V. Vorburger
In scanned probe measurements of micrometer- or nanometer-scale lines, it is nearly impossible to maintain the sample in a perfectly level position, and even a small amount of tilt angle can contribute to the accuracy of the result of measurand such as

A Time-Resolved Kinetic Monte-Carlo Simulation Study On Si (111) Etching

January 1, 2007
Author(s)
Hui Zhou, Joseph Fu, Richard M. Silver
In this paper we have extended the Kinetic Monte-Carlo simulation method to study the etching dynamics of Si (111) surfaces in NH4F in a time-resolved basis. We have examined the step-flow dynamics of Si(111) etching using various simulation window sizes

Calibrated Overlay Wafer Standard

January 1, 2007
Author(s)
Michael T. Stocker, Richard M. Silver, Ravikiran Attota, Jay S. Jun
This document describes the physical characteristics of Standard Reference Material SRM 5000, provides guidance for its use in calibrating overlay (OL) tools, and gives information and precautions concerning its care and handling.Standard Reference

Comparison of Optical and Stylus Methods for Measurement of Rough Surfaces

January 1, 2007
Author(s)
Theodore V. Vorburger, H G. Rhee, Thomas B. Renegar, Jun-Feng Song, Xiaoyu A. Zheng
Abstract Optical methods are increasingly used for measurement of surface texture, particularly for areal measurements where the optical methods are generally faster. A new Working Group under Technical Committee (TC) 213 in the International Organization

Fundamental Limits of Optical Critical Dimension Metrology: A Simulation Study

January 1, 2007
Author(s)
Richard M. Silver, Thomas A. Germer, Ravikiran Attota, Bryan M. Barnes, B Bunday, J Allgair, Egon Marx, Jay S. Jun
This paper is a comprehensive summary and analysis of a SEMATECH funded project to study the limits of optical critical dimension scatterometry. The project was focused on two primary elements: 1) the comparison, stability, and validity of industry models
Displaying 1301 - 1325 of 2125