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Search Publications

NIST Authors in Bold

Displaying 1426 - 1450 of 2142

A Modular System Architecture for Agile Assembly of Nanocomponents using Optical Tweezers

September 10, 2005
Author(s)
Arvind K. Balijepalli, Thomas W. LeBrun, Cedric V. Gagnon, Yong-Gu Lee, Nicholas G. Dagalakis
In order to realize the flexibility optical trapping offers as a nanoassembly tool, we need to develop natural and intuitiveinterfaces to assemble large quantities of nanocomponents quickly and cheaply. We propose a system to create such aninterface that

Issues in Line Edge and Linewidth Roughness Metrology

September 9, 2005
Author(s)
John S. Villarrubia
In semiconductor electronics applications, line edge and linewidth roughness are generally measured using a root mean square (RMS) metric. The true value of RMS roughness depends upon the length of edge or line that is measured and the chosen sampling

Characterization of Optical Traps Using On-Line Estimation Methods

August 26, 2005
Author(s)
Jason J. Gorman, Thomas W. LeBrun, et al
System identification methods are presented for the estimation of the characteristic frequency of an optically trapped particle. These methods are more amenable to automated on-line measurements and are believed to be less prone to erroneous results

Dynamic Modeling and Vibration Analysis of a UHV Scanning Tunneling

August 17, 2005
Author(s)
Sumanth B. Chikkamaranahalli, R. R. Vallance, Bradley N. Damazo, Richard M. Silver, James D. Gilsinn
Techniques based on scanning probe microscopy (SPM) are used to fabricate surface structures with dimensions ranging from 10 - 100mm. These structures have been fabricated and imaged using a scanning tunneling microscope (STM), and the STM requires the tip

A Fiber Probe for CMM Measurements of Small Features

August 1, 2005
Author(s)
Jack A. Stone Jr., Balasubramanian Muralikrishnan, John R. Stoup
We report on performance of a new form of fiber probe, which can be used in conjunction with a coordinate measuring machine (CMM) for microfeature measurement. The probe stylus is a glass fiber with a small ball (?75 ?m diameter) glued to the end. When the

A Simulation Study of Repeatability and Bias in the CD-SEM

July 1, 2005
Author(s)
John S. Villarrubia, Andras Vladar, Michael T. Postek
Abstract: The ability of a critical dimension scanning electron microscope (CD-SEM) to resolve differences in the widths of two lines depends on the instrument?s measurement repeatability and any sample dependent biases. The dependence of repeatability and

Development of Multiple Beam Optical Tweezers

June 1, 2005
Author(s)
Dongjin Lee, Thomas W. LeBrun, Arvind Balijepalli, Jason J. Gorman, Cedric V. Gagnon, Daehie Hong, Esther H. Chang
This paper presents the design of a multiple beam optical tweezers instrument used for manipulating micro/nano-sized components. The basic equations used in designing the optical tweezers are derived and the stable and time-sharing multiple beam optical

SysML and UML 2 Support for Activity Modeling

June 1, 2005
Author(s)
Conrad E. Bock
This article describes activity modeling as specified by the Systems Modeling Language (SysML) and the finalization of the Unified Modeling Language version 2 (UML 2). It reviews and updates an earlier proposed alignment between Enhanced Functional Flow

High-resolution Optical Metrology

May 1, 2005
Author(s)
Richard M. Silver, Ravikiran Attota, Michael T. Stocker, M R. Bishop, Lowell P. Howard, Thomas A. Germer, Egon Marx, M P. Davidson, Robert D. Larrabee
Recent advances in optical imaging techniques have unveiled new possibilities for optical metrology and optical-based process control measurements of features in the 65 nm node and beyond. In this paper we discuss methods and applications that combine

Measuring Internal Geometry of Fiber Ferrules

May 1, 2005
Author(s)
Balasubramanian Muralikrishnan, Jack A. Stone Jr., John R. Stoup
The focus of this paper is on the metrology of microstructures. Traditional Coordinate Measuring Machines (CMM) are limited to measuring holes of 300 m diameter. Smaller features and holes require thinner styli & novel probing technologies that can

Micro-Feature Metrology

May 1, 2005
Author(s)
Bala Muralikrishnan, Jack A. Stone Jr., John R. Stoup
This presentation focuses on three aspects of micro-feature metrology novel applications that drive research and commercialization, capabilities and limitations of existing sensors and techniques, and finally a summary of recent research including ongoing

PSL: A Semantic Domain for Flow Models

May 1, 2005
Author(s)
Conrad Bock, Michael Gruninger
Flow models underlie popular programming languages and many graphical behavior specification tools. However, their semantics is typically ambiguous, causing miscommunication between modelers and unexpected implementation results. This article introduces a

Systems Engineering in the Product Lifecycle

May 1, 2005
Author(s)
Conrad E. Bock
This article introduces basic elements of systems engineering that are useful in managing the product lifecycle, as expressed in an extension to the Unified Modeling Language. Models are described for product requirements in textual and computable form

Unbiased Estimation of Linewidth Roughness

May 1, 2005
Author(s)
John S. Villarrubia, B Bunday
Line width roughness (LWR) is usually estimated simply as three standard deviations of the line width. The effect of image noise upon this metric includes a positive nonrandom component. The metric is therefore subject to a bias or ?systematic error? that

The Programs of the Manufacturing Engineering Laboratory 2005

April 8, 2005
Author(s)
Lisa J. Fronczek, Bessmarie A. Young
The National Institute of Standards and Technology s Manufacturing Engineering Laboratory (MEL) strengthens the U.S. economy and improves the quality of life by working with the U.S. manufacturing industry to develop and apply infrastructural technology

Photomask Feature Metrology

April 7, 2005
Author(s)
James E. Potzick
This chapter discusses some general issues with regard to measurement of the size and placement of the features on a photomask.
Since all linewidth and placement measurements derive from the location of a feature's edges, the Chapter starts with a

Comparison of SEM and HRTEM CD-Measurements Extracted From Monocrystalline Tes-Structures Having Feature Linewidths From 40 nm to 240 nm

April 4, 2005
Author(s)
W Tan, Robert Allen, Michael W. Cresswell, Christine E. Murabito, B C. Park, Ronald G. Dixson, William F. Guthrie
CD measurements have been extracted from SEM and HRTEM images of the same set of monocrystalline silicon features having linewidths between 40 and 200 nm. The silicon features are incorporated into a new test structure which has been designed to facilitate

Magnetic Method to Characterize the Current Densities in a Breaker Arc

April 1, 2005
Author(s)
Nadia Machkour-Deshayes
The purpose of this research was to use magnetic induction measurements from a low voltage electric arc, to reconstruct the arc''s current density. The measurements were made using Hall effect sensors, which were placed close to, but outside the breaking

Optical Flatness Metrology for 300 mm Silicon Wafers

April 1, 2005
Author(s)
Ulf Griesmann, Quandou (. Wang, T D. Raymond
At the National Institute of Standards and Technology (NIST), we are developing two interferometric methods for measuring the thickness variation and flatness of free-standing and chucked silicon wafers with diameters up to 300mm. The eXtremely accurate
Displaying 1426 - 1450 of 2142