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Search Publications by: John V. Messina (Fed)

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Displaying 76 - 84 of 84

PWB Warpage Analysis and Verification using an AP210 Standards-based Engineering Framework and Shadow Moire

March 10, 2004
Author(s)
Dirk Zwemer, Manas Bajaj, Russell Peak, Thomas Thurman, Kevin G. Brady, S McCarron, A Spradling, Mike Dickerson, Lothar Klein, Giedrius Liutkus, John V. Messina
Thermally induced warpage of printed wiring boards (PWB) and printed circuit assemblies (PCA) is an increasingly important issue in managing the manufacturing yield and reliability of electronic devices. In this paper, we introduce complementary simulation

From Databooks to Online Dictionaries and Parts Catalogues

January 5, 2004
Author(s)
John V. Messina, James A. St Pierre
This power point presentation was presented at the 4th Annual ECCMA Membership Conference at Lehigh University on October 22nd, 2003 during a panel presentation on competitive sourcing, parts interoperability, and inventory visibility in public sector

From Databooks to Online Dictionaries and Parts Catalogues

October 27, 2003
Author(s)
John V. Messina, James A. St Pierre
This power point presentation was presented at the 4th Annual ECCMA Membership Conference at Lehigh University on October 22nd, 2003 during a panel presentation on competitive sourcing, parts interoperability, and inventory visibility in public sector

Design and Development of a Dictionary Translator

January 1, 1999
Author(s)
John V. Messina, James A. St Pierre, Michael R. McCaleb
The lack of a traceable set of terminologies to describe electronic components has long been identified by the electronic industry as a significant problem. As part of its Electronic Commerce of Component Information (ECCI) project, NIST's Electronic