December 13, 2013
Author(s)
Eric Chason, Alison Engwal, Fei Pei, Manon C. Lafouresse, Ugo Bertocci, Gery R. Stafford, Joseph A. Murphy, Catherine Lenihan, D. N. Buckley
We report on the results of a multi-laboratory study to measure the steady state growth stress of planar copper thin films, electrodeposited from additive-free acidic sulfate electrolyte. Measurements were made using the wafer curvature method, that