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Search Publications by: Gery R. Stafford (Assoc)

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Displaying 26 - 50 of 77

Vacancy-Hydrogen Defects in Aluminum Formed During Aqueous Dissolution

September 16, 2010
Author(s)
K. R. Hebert, J. Ai, Gery R. Stafford, K. M. Ho, C. Z. Wang
Aqueous dissolution of aluminum is accompanied by extensive absorption of hydrogen, along with formation of hydride and voids. We used in situ stress measurements to discriminate between absorption mechanisms leading to either interstitial or vacancy

In-situ Stress Measurements During Electrodeposition of Au-Ni Alloys

September 10, 2010
Author(s)
Eric Rouya, Gery R. Stafford, Carlos R. Beauchamp, J. A. Floro, R. G. Kelly, Reed L. M., Zangari G.
We investigate the stress evolution in-situ during the potentiostatic electrodeposition of metastable, nanostructured Au-Ni alloy films, and develop a correlation between the alloy nucleation and growth mode, the growth rate, alloy composition and the

Electrodeposition of Metastable Au-Ni Alloys

May 13, 2010
Author(s)
Gery R. Stafford, E. Rouya, Ugo Bertocci, J. J. Mallett, R. Schad, M. R. Begley, R. G. Kelly, M. Reed, G. Zangari
The electrodeposition of Au-Ni alloys from near neutral, sulfite-based electrolytes derived from a commercial bath for soft gold plating is investigated. Alloy compositions ranging from 0 to 90 at% Ni were obtained by varying the deposition potential, with

Whisker Formation in Pb-Free Surface Finishes

February 2, 2010
Author(s)
Gery R. Stafford, Maureen E. Williams, Jae W. Shin, Kil-Won Moon, William J. Boettinger, Carlos R. Beauchamp
Tin(Sn)-lead(Pb) alloys have been used extensively for surface finishing of electronic components in part because Pb was found to be effective in retarding Sn whisker growth in electrodeposits. Altough whiskers appear to be a local response to the

400-Fold Reduction in Saturation Field by Interlayering

January 13, 2009
Author(s)
William F. Egelhoff Jr., John E. Bonevich, Philip Pong, John Unguris, Robert D. McMichael, Gery R. Stafford, Carlos R. Beauchamp
The buildup of stress with increasing thickness of magnetic thin films is a common phenomenon that often induces undesirable saturation fields that can convert an otherwise magnetically soft film into a magnetically hard one. We have found that by

Nanotwin formation and its physical properties and effect on reliability of copper interconnects.

May 3, 2008
Author(s)
Di Xu, Vinay Sriram, Vidvuds Ozolins, Jenn-Ming Yang, K. N. Tu, Gery R. Stafford, Carlos R. Beauchamp, Inka Zienert, Holm Geisler, Petra Hofmann, Ehrenfried Zschech
Ultra-fine grained copper with a large amount of nano-scale twin boundaries has high mechanical strength and maintain normal electrical conductivity. The combination of these properties may lead to promising applications in future Si microelectronic

Aluminum UPD and Alloy Formation on (111)-Textured Au in AlCl_{3}-EMImCl

March 20, 2008
Author(s)
Gery R. Stafford, G Haarberg
The kinetics of Al-Au surface alloy formation was examined during Al underpotential deposition (upd) onto (111)-texture Au from Lewis acidic aluminum chloride-1-ethyl-3-methlimidazolium chloride (AlCl_{3}-EMImCl)using linear sweep stripping voltammetry

Equi-Axed Grain Formation in Electrodeposited Sn-Bi

December 29, 2007
Author(s)
E Sandnes, Maureen E. Williams, Mark D. Vaudin, Gery R. Stafford
Sn is widely used as a coating in the electronics industry because it provides excellent solderability, ductility, electrical conductivity and corrosion resistance. However, Sn whiskers have been observed to grow spontaneously from Sn electrodeposits and

Electrodeposition of Bismuth From Nitric Acid Electrolyte

April 2, 2007
Author(s)
E Sandnes, Maureen E. Williams, Ugo Bertocci, Mark D. Vaudin, Gery R. Stafford
The electrodeposition of Bi from acidic nitrate solution was examined. Bismuth deposition was determined to be quasi-reversible on Au, with a current efficiency of 100%, based on integration of deposition and stripping voltammetric waves. No interference