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Search Publications by: Gery R. Stafford (Assoc)

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Displaying 26 - 50 of 151

Role of Elastic Strain on Electrocatalysis of Oxygen Reduction Reaction on Pt

July 23, 2015
Author(s)
Gery R. Stafford, Vijay Sethuraman, Deepa Vairavapandian, Manon C. Lafouresse, Tuhina Maark, Naba Karan, Shouheng Sun, Ugo Bertocci, Andrew Peterson, Pradeep Guduru
The effect of elastic strain on catalytic activity of platinum (Pt) towards oxygen reduction reaction (ORR) is investigated through de-alloyed Pt-Cu thin films; stress evolution in the de-alloyed layer and the mass of the Cu removed are measured in real

Dynamic Stress Analysis Applied to the Electrodeposition of Copper

March 16, 2015
Author(s)
Manon C. Lafouresse, Ugo Bertocci, Gery R. Stafford
Stress development during the electrodeposition of copper from additive-free, acidic CuSO_(4) electrolyte was analyzed by dynamic stress analysis, an in situ characterization technique that combines electrochemical impedance spectroscopy with cantilever

Electrodeposition of Al-W Alloys in the Lewis Acidic Aluminum Chloride-1-Ethyl-3-Methylimidazolium Chloride Ionic Liquid

April 24, 2014
Author(s)
Tetsuya Tsuda , Yuichi Ikeda , Takashi Arimura, Masaki Hirogaki, Akinito Imanishi, Susumu Kuwabata, Gery R. Stafford, Charles Hussey
The electrodeposition of non-equilibrium Al-W alloys was investigated in the Lewis acidic 66.7-33.3 % mole fraction aluminum chloride-1-ethyl-3-methylimidazolium chloride (AlCl_(3)-[EtMeIm]Cl) room-temperature ionic liquid (IL). The W(III) compound, K_(3)

Understanding residual stress in electrodeposited Cu thin films

December 13, 2013
Author(s)
Eric Chason, Alison Engwal, Fei Pei, Manon C. Lafouresse, Ugo Bertocci, Gery R. Stafford, Joseph A. Murphy, Catherine Lenihan, D. N. Buckley
We report on the results of a multi-laboratory study to measure the steady state growth stress of planar copper thin films, electrodeposited from additive-free acidic sulfate electrolyte. Measurements were made using the wafer curvature method, that

Dynamic Stress Analysis Applied to (111)-Textured Pt in HClO_(4) Electrolyte

July 20, 2013
Author(s)
Manon C. Lafouresse, Ugo Bertocci, Gery R. Stafford
Dynamic stress analysis (DSA) was performed on Pt cantilever electrodes immersed in a 0.1 mol/L HClO_(4) electrolyte. DSA combines elements of electrochemical impedance spectroscopy (EIS) and cantilever curvature. In this paper DSA is used to determine the

Stress Control in Electrodeposited CoFe Films - Experimental Study and Analytical Model

July 25, 2012
Author(s)
Stanko R. Brankovic, Burhanuddin Kagajwala, Jinnie George, Shruti Santangopalan, Gery R. Stafford, Paul Ruchhoeft
The work investigating the effect of saccharine as an additive on growth stress and structure of electrodeposited CoFe films is presented. The saccharine concentrations were in the range between 0 gL^(-1) and 1.5 g^(L-1). The stress measurements are

In situ stress measurement during electrodeposition of Ni_(x)Pt_(1-x) alloys

June 20, 2012
Author(s)
Jae W. Shin, Carlos M. Hangarter, Ugo Bertocci, Yihua Y. Liu, Thomas P. Moffat, Gery R. Stafford
Stress generation was examined during the electrodeposition of NixPt1-x alloys from 0.5 M NaCl + 3 mM K2PtCl4 + 0.1 M NiCl2 (pH=2.5), using the wafer curvature method, in films measuring less than 50 nm in thickness. Steady state tensile stress, ranging