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Search Publications by: Daniel Josell (Fed)

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Displaying 151 - 175 of 273

Superfilling When Adsorbed Accelerators Are Mobile

February 6, 2007
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Bottom-up superfill during electrodeposition that is used for industrial processing of damascene copper interconnects has also been demonstrated during electrodeposition of silver and gold. The Curvature Enhanced Accelerator Coverage (CEAC) mechanism has

Cationic Surfactants for the Control of Overfill Bumps in Cu Superfilling

October 10, 2006
Author(s)
Soo K. Kim, Daniel Josell, Thomas P. Moffat
Electroanalytical measurements and feature filling experiments have been conducted to study the effect of dodecyltrimethylammonium chloride (DTAC), a quaternary ammonium cationic surfactant, on Cu deposition in the presence of various combinations of

Curvature Enhanced Adsorbate Coverage Model for Electrodeposition

January 11, 2006
Author(s)
Thomas P. Moffat, Daniel Wheeler, Soo K. Kim, Daniel Josell
The impact of leveling additives acting through the traditional leveling mechanism of accumulation and consumption has been coupled with the Curvature Enhanced Accelerator Coverage (CEAC) mechanism previously used to explain bottom-up superfill of features

Electrodeposition of Cu on Ru Barrier Layers for Damascene Processing

December 2, 2005
Author(s)
Thomas P. Moffat, Marlon L. Walker, P J. Chen, John E. Bonevich, William F. Egelhoff Jr., Lee J. Richter, Daniel Josell, C A. Witt, T Aaltonen, M Ritala, M Leskela
Superfilling of sub-micrometer trenches by direct copper electrodeposition onto PVD and ALD Ru barriers is demonstrated. The Cu nucleation and growth mode is found to be sensitive to the oxidation state of the Ru surface as well as the copper deposition

Gold Superfill in Sub-Micrometer Trenches: Experiment and Prediction

November 16, 2005
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Bottom-up deposition of gold in fine trenches, also called superfill, was recently demonstrated using a submonolayer coverage of preadsorbed, deposition-rate-accelerating lead followed by gold electrodeposition. The present study has used experiments on