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Search Publications by: Daniel Josell (Fed)

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Displaying 201 - 225 of 273

Accelerator Aging Effects During Copper Electrodeposition

April 1, 2003
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, Daniel Josell
Slow sweep rate voltammetric analysis of the Cu/Cu(II) deposition reaction is shown to be an effective tool for examining aging effects associated with thiol and disulfide additives that are widely employed as brighteners. Sulfonate-terminated short chain

Superconformal Electrodeposition of Silver from a KAg(CN) 2 -KCN-KSeCN Electrolyte

February 1, 2003
Author(s)
B C. Baker, M Freeman, B Melnick, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Electrodeposition of silver from a KAg(CN) 2-KCN electrolyte was investigated. The addition of potassium selenocyanate (KSeCN) results in a hysteretic current-voltage response, specular films and superconformal growth in submicrometer vias. These

A Mechanism for Brightening: Linear Stability Analysis of the Curvature Enhanced Coverage Model

January 6, 2003
Author(s)
Geoffrey B. McFadden, Sam R. Coriell, Thomas P. Moffat, Daniel Josell, Daniel Wheeler, W Schwarzacher
This work presents experiments and theory describing a mechanism for how brighteners in electrolytes function. The mechanism involves change of local coverage of a deposition rate enhancing catalyst adsorbed on the surface through change of local surface

Superconformal Electrodeposition Using Derivitized Substrates

December 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, C Witt, Daniel Josell
This paper demonstrates superconformal electrodeposition of copper in trenches using a two step process. The substrate is first derivitized with a submonolayer coverage of catalyst and then transferred for electroplating in a cupric sulfate electrolyte

Superconformal Film Growth

October 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
Superconformal electrodeposition of copper is explained by the recently developed curvature enhanced accelerator coverage (CEAC) mechanism. The model stipulates that 1. the growth velocity is proportional to the local accelerator, or catalyst, surface

Superconformal Electrodeposition of Silver in Submicrometer Features

August 1, 2002
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, John E. Bonevich, Monica D. Edelstein, D R Kelly, L Gan, Gery R. Stafford, P J. Chen, William F. Egelhoff Jr., Daniel Josell
The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyanide