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Search Publications by: Jan Obrzut (Fed)

Displaying 101 - 113 of 113

High Frequency Input Impedance Characterization of Dielectric Films for Power-Ground Planes

January 1, 2002

Author(s)

Jan Obrzut, O Anopchenko

Dielectric Properties of Polymer/Ferroelectric Ceramic Composites From 100 Hz to 10 GHz

August 1, 2001

Author(s)

R Popielarz, C. K. Chiang, R Nozaki, Jan Obrzut

Dielectric properties of model BaTiO 3/polymer composites were measured over a broad frequency and temperature range. A series of BaTiO 3/monomer suspensions were photocured into thin wafers. The wafers were equipped with aluminum electrodes and the

Broadband Dielectric Relaxation of Polymer Composite Films

January 1, 2001

Author(s)

C. K. Chiang, R Popielarz, R Nozaki, Jan Obrzut

The broadband dielectric relaxation of a BaTiO3-polymer composite film was studied. The complex dielectric constant data from 10 -4 Hz to 10 10 Hz reveals the existence of a relaxation process at a frequency of 10 MHz in the polymer composite. On the basis

Dielectric Characterization of Embedded Decoupling Capacitance Films at Microwave Frequencies

January 1, 2001

Author(s)

Jan Obrzut

The dielectric permittivity and impedance characteristics were evaluated for high-dielectric constant polymer composite films, that are being developed by the industry for Embedded De-coupling Capacitance (EDC) applications. In order to extend the

Preparation and Characterization of Photopatternable BaTiO 3 / Polymer Composites

January 1, 2001

Author(s)

R Popielarz, C. K. Chiang, R Nozaki, Jan Obrzut

The dielectric properties of acrylic resin composites filled with BaTiO 3 have been evaluated in the broad frequency range. These materials were used as models to study the dielectric response in polymer composite films for de-coupling capacitance

Embedded Decoupling Capacitance Materials Characterization

December 1, 2000

Author(s)

Jan Obrzut

The dielectric constant of the embedded capacitance materials was measured in the frequency range from 100 Hz to 5 GHz. The testing included evaluation of the capacitance density, leakage current, and the effect of HAST on the capacitance. A test specimen

Permittivity Measurements of High Dielectric Constant Films at Microwave Frequencies

April 1, 2000

Author(s)

Jan Obrzut, R Nozaki

We have developed a time-domain reflectometry (TDR) technique to measure the dielectric permittivity of high dielectric constant films. The test specimen consists of a planar capacitor terminating coaxial waveguide. The complex permittivity of the

Evaluation of Dielectric Properties of Polymer Thin-Films Materials for Application in Embedded Capacitance

January 1, 2000

Author(s)

Jan Obrzut, C. K. Chiang, R Popielarz, R Nozaki

The relative dielectric constant of the embedded capacitance materials was measured in the frequency range of 100 Hz to 5 GHz. The testing included evaluation of the capacitance density, leakage current, and the effect of environmental stress on the

Microwave Dielectric Characterization of Polyaniline Composites

January 1, 2000

Author(s)

Jan Obrzut, C. K. Chiang

Dielectric permittivity of polyaniline (emerdaline salt) and its dispersions in epoxy glasses have been investigated in the frequency rangebetween 1 GHz to 18 GHz by using the reflection - transmission method. The observed high value of the dielectric

Preparation and Characterization of Photopatternable BaTiO3/Polymer Composites

January 1, 2000

Author(s)

R Popielarz, C. K. Chiang, R Nozaki, Jan Obrzut

Compensation of Thermal Expansiveness In Plastic DCA-Flip-Chip Assemblies Using A Mechanically Compliant Dielectric

May 3, 1999

Author(s)

Jan Obrzut

Application of a compliant, low modulus dielectric layer between the chip joints (C4) and the carrier can decrease the thermally induced bending and probability of failure. Model analysis and experimental data indicate that the optimal thickness of the

Plastic Flip-Chip-BGA Carrier With Microvias for Chip Scale Packaging

June 2, 1998

Author(s)

Jan Obrzut, M Jimarez

We evaluated a near-chip-scale package, that utilizes the flip-chip, plastic-ball-grid-array technology with microvias. The microvias were photolithographically patterned in built-up dielectric layers. We verified optimal conditions for photo-exposure and

Interconnection Continuity Test for Packaged Functional Modules

March 3, 1998

Author(s)

Jan Obrzut

We developed an electrical test to evaluate interconnections in packaged, electrostatic-discharge (ESD) protected modules. The ESD protection circuit, which in modern integrated circuits is present at every I/O as an inherent part of the chip structure