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Search Publications by: Erik M. Secula (Fed)

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Displaying 26 - 42 of 42

Round Robin for Standardization of MEMS Length and Strain Measurements

July 12, 2004
Author(s)
Janet M. Cassard, Erik M. Secula, J Huang
A microelectromechanical systems (MEMS) Length and Strain Round Robin is underway to compare results of in-plane length measurements, residual strain measurements, and strain gradient measurements at a number of laboratories. The goal of this round robin

Semiconductor Electronics Division

September 30, 2003
Author(s)
David G. Seiler, Erik M. Secula
This is a high-level, full-color brochure detailing the activities and challenges of the Semiconductor Electronics Division. Topics include Division history, nanotechnology, MEMS, electrical test structures, power electronics, optical and electrical