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Search Publications by: William Alexander Osborn (Fed)

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Displaying 1 - 25 of 59

Nanocalorimetry for plasma metrology relevant to semiconductor fabrication

February 4, 2025
Author(s)
John Diulus, Carles Corbella Roca, Feng Yi, David LaVan, Berc Kalanyan, Mark McLean, Lakshmi Ravi Narayan, William Osborn, James Maslar, Andrei Kolmakov
This letter reports on pilot tests of microfabricated nanocalorimeters as a metrology platform for the rapid (sub-100 ms response time) and sensitive detection of neutral radicals generated by reactive cold plasmas, typical in plasma cleaning applications

Growth and Decomposition of Pt Surface Oxides

June 28, 2022
Author(s)
Feng Yi, Shane Arlington, Justin Gorham, William Alexander Osborn, Slavomir Nemsak, Ethan Crumlin, David A. LaVan
The formation and thermal stability of Pt surface oxides on Pt thin film were studied in situ using ambient pressure x-ray photoelectron spectroscopy (AP-XPS). AP-XPS allows us to monitor the chemical states of both adsorbed reactants and underlying

Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

March 25, 2022
Author(s)
Daniel Josell, William Alexander Osborn, Maureen E. Williams
This work extends application of an extreme variant of superconformal Au electrodeposition to deeper device architectures while exploring factors that constrain its function and thereby the robustness of void-free processing. The unconventional bottom-up

Visualizing Shed Skin Cells in Fingerprint Residue using Dark Field Microscopy

March 5, 2020
Author(s)
Shinichiro N. Muramoto, William Alexander Osborn, J Greg Gillen
The proof of concept study was able to show that dark field microscopy could be used to provide sufficient contrast for cell visualization in fingerprints with high sebum content. Although the application is limited to smooth surfaces that do not scatter

Protocols for tensile testing flexible unidirectional composite laminates

April 27, 2019
Author(s)
Amy E. Engelbrecht-Wiggans, Ajay Krishnamurthy, Faraz A. Burni, William A. Osborn, Amanda L. Forster
Many body armor designs incorporate unidirectional (UD) laminates. UD laminates are constructed of thin layers of high performance yarns where the yarns in each layer are oriented parallel to each other and held in place using binder resins and thin

In-situ Elastic Strain Mapping During Micromechanical Testing Using EBSD

November 14, 2017
Author(s)
Mark McLean, William A. Osborn
Compared to more commonly used strain measurement techniques, EBSD offers improved spatial resolution and measurement sensitivity. Additionally, EBSD can provide the full deformation tensor, whereas other techniques, such as DIC, are limited to only in

Strain Measurement of 3D Structured Nanodevices by EBSD

August 20, 2017
Author(s)
William A. Osborn, Lawrence H. Friedman, Mark D. Vaudin
We present a new methodology to accurately measure strain magnitudes from 3D nanodevices using Electron Backscatter Diffraction (EBSD). Because the dimensions of features on these devices are smaller than the interaction volume for backscattered electrons