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Search Publications by: William Alexander Osborn (Fed)

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Displaying 1 - 25 of 29

Growth and Decomposition of Pt Surface Oxides

June 28, 2022
Author(s)
Feng Yi, Shane Arlington, Justin Gorham, William Alexander Osborn, Slavomir Nemsak, Ethan Crumlin, David A. LaVan
The formation and thermal stability of Pt surface oxides on Pt thin film were studied in situ using ambient pressure x-ray photoelectron spectroscopy (AP-XPS). AP-XPS allows us to monitor the chemical states of both adsorbed reactants and underlying

Robust Bottom-Up Gold Filling of Deep Trenches and Gratings

March 25, 2022
Author(s)
Daniel Josell, William Alexander Osborn, Maureen E. Williams
This work extends application of an extreme variant of superconformal Au electrodeposition to deeper device architectures while exploring factors that constrain its function and thereby the robustness of void-free processing. The unconventional bottom-up

Visualizing Shed Skin Cells in Fingerprint Residue using Dark Field Microscopy

March 5, 2020
Author(s)
Shinichiro N. Muramoto, William Alexander Osborn, J Greg Gillen
The proof of concept study was able to show that dark field microscopy could be used to provide sufficient contrast for cell visualization in fingerprints with high sebum content. Although the application is limited to smooth surfaces that do not scatter

Protocols for tensile testing flexible unidirectional composite laminates

April 27, 2019
Author(s)
Amy E. Engelbrecht-Wiggans, Ajay Krishnamurthy, Faraz A. Burni, William A. Osborn, Amanda L. Forster
Many body armor designs incorporate unidirectional (UD) laminates. UD laminates are constructed of thin layers of high performance yarns where the yarns in each layer are oriented parallel to each other and held in place using binder resins and thin

In-situ Elastic Strain Mapping During Micromechanical Testing Using EBSD

November 14, 2017
Author(s)
Mark McLean, William A. Osborn
Compared to more commonly used strain measurement techniques, EBSD offers improved spatial resolution and measurement sensitivity. Additionally, EBSD can provide the full deformation tensor, whereas other techniques, such as DIC, are limited to only in

Strain Measurement of 3D Structured Nanodevices by EBSD

August 20, 2017
Author(s)
William A. Osborn, Lawrence H. Friedman, Mark D. Vaudin
We present a new methodology to accurately measure strain magnitudes from 3D nanodevices using Electron Backscatter Diffraction (EBSD). Because the dimensions of features on these devices are smaller than the interaction volume for backscattered electrons

Assessing Electron Backscattered Diffraction and Confocal Raman Microscopy Strain Mapping Using Wedge-indented Si

February 17, 2016
Author(s)
Lawrence Henry Friedman, Mark D. Vaudin, Stephan J. Stranick, Gheorghe Stan, Yvonne B. Gerbig, William Alexander Osborn, Robert F. Cook
The accuracy of electron backscattered diffraction (EBSD) and confocal Raman microscopy (CRM) for small-scale strain mapping are assessed using the multi-axial strain field surrounding a wedge indentation in Si as a test vehicle. The strain field is

Smart Electronic Laboratory Notebooks for the NIST Research Environment

December 2, 2015
Author(s)
Richard S. Gates, Mark McLean, William A. Osborn
Laboratory notebooks have been a staple of scientific research for centuries for organizing and documenting ideas and experiments. Modern laboratories are more and more reliant on electronic data collection and analysis so it seems inevitable that the

Detecting Carbon in Carbon: Application of Differential Charging to Obtain Information on the Chemical Identity and Spatial Location of Carbon Nanotube Aggregates in Composites by Imaging X-ray Photoelectron Spectroscopy

October 24, 2015
Author(s)
Justin M. Gorham, William A. Osborn, Jeremiah W. Woodcock, Keana C. Scott, John M. Heddleston, Angela R. Hight Walker, Jeffrey W. Gilman
The surface contributions and dispersion properties of multiwalled carbon nanotubes (MWCNT) within a composite are important measurements to perform on nano-enabled products in order to help answer environmental health and safety questions associated with

CCQM Pilot Study P-140; Quantitative Surface Analysis of Multi-Element Alloy Films

October 1, 2015
Author(s)
David S. Simons, Christopher W. Szakal, William A. Osborn, Kyung Joong Kim
A pilot study for the quantitative surface analysis of multi-element alloy films has been performed by the Surface Analysis Working Group (SAWG) of the Consultative Committee for Amount of Substance (CCQM). The aim of this pilot study is to ensure the

Micromechanical Testing of Electroplated Gold Alloy Films using Theta-Like Specimens

July 2, 2015
Author(s)
Mark McLean, William A. Osborn, Oliver Boomhower, Christopher Keimel, Rebecca Kirkpatrick, Frank W. DelRio
Micromechanical testing of electroplated gold alloy films has been conducted using the theta specimen geometry. Specimens were formed by a standard combination of photolithography, electroplating, and deep reactive ion etching. Testing was performed using

Designing a standard for strain mapping: HR-EBSD analysis of SiGe thin film structures on Si

January 1, 2015
Author(s)
Mark D. Vaudin, William A. Osborn, Lawrence H. Friedman, Justin M. Gorham, Robert F. Cook, Victor Vartanian
Patterned SiGe thin film structures, heteroepitaxially deposited on Si substrates, are investigated as potential reference standards to establish the accuracy of high resolution electron backscattered diffraction (HR-EBSD) strain measurement methods. The

On the bending strength of single-crystal silicon theta-like specimens

July 10, 2013
Author(s)
Rebecca R. Kirkpatrick, William Alexander Osborn, Michael S. Gaither, Richard S. Gates, Frank W. DelRio, Robert F. Cook
A new theta geometry was developed for micro-scale bending strength measurements. The new "gap" theta specimen was a simple modification of the arch theta specimen that enabled micro-scale tensile testing. The gap theta was demonstrated here on single

Surface mediated assembly of small, metastable gold nanoclusters

May 27, 2013
Author(s)
John M. Pettibone, William A. Osborn, Konrad Rykaczewski, Albert A. Talin, John E. Bonevich, Jeffrey W. Hudgens
The unique properties of metallic nanoclusters are attractive for numerous commercial and industrial applications but are generally less stable than nanocrystals. Thus, developing methodologies for stabilizing nanoclusters and retaining their enhanced