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Search Publications by: William Alexander Osborn (Fed)

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Displaying 26 - 50 of 59

Assessing Electron Backscattered Diffraction and Confocal Raman Microscopy Strain Mapping Using Wedge-indented Si

February 17, 2016
Author(s)
Lawrence Henry Friedman, Mark D. Vaudin, Stephan J. Stranick, Gheorghe Stan, Yvonne B. Gerbig, William Alexander Osborn, Robert F. Cook
The accuracy of electron backscattered diffraction (EBSD) and confocal Raman microscopy (CRM) for small-scale strain mapping are assessed using the multi-axial strain field surrounding a wedge indentation in Si as a test vehicle. The strain field is

Smart Electronic Laboratory Notebooks for the NIST Research Environment

December 2, 2015
Author(s)
Richard S. Gates, Mark McLean, William A. Osborn
Laboratory notebooks have been a staple of scientific research for centuries for organizing and documenting ideas and experiments. Modern laboratories are more and more reliant on electronic data collection and analysis so it seems inevitable that the

Detecting Carbon in Carbon: Application of Differential Charging to Obtain Information on the Chemical Identity and Spatial Location of Carbon Nanotube Aggregates in Composites by Imaging X-ray Photoelectron Spectroscopy

October 24, 2015
Author(s)
Justin M. Gorham, William A. Osborn, Jeremiah W. Woodcock, Keana C. Scott, John M. Heddleston, Angela R. Hight Walker, Jeffrey W. Gilman
The surface contributions and dispersion properties of multiwalled carbon nanotubes (MWCNT) within a composite are important measurements to perform on nano-enabled products in order to help answer environmental health and safety questions associated with

CCQM Pilot Study P-140; Quantitative Surface Analysis of Multi-Element Alloy Films

October 1, 2015
Author(s)
David S. Simons, Christopher W. Szakal, William A. Osborn, Kyung Joong Kim
A pilot study for the quantitative surface analysis of multi-element alloy films has been performed by the Surface Analysis Working Group (SAWG) of the Consultative Committee for Amount of Substance (CCQM). The aim of this pilot study is to ensure the

Micromechanical Testing of Electroplated Gold Alloy Films using Theta-Like Specimens

July 2, 2015
Author(s)
Mark McLean, William A. Osborn, Oliver Boomhower, Christopher Keimel, Rebecca Kirkpatrick, Frank W. DelRio
Micromechanical testing of electroplated gold alloy films has been conducted using the theta specimen geometry. Specimens were formed by a standard combination of photolithography, electroplating, and deep reactive ion etching. Testing was performed using

Designing a standard for strain mapping: HR-EBSD analysis of SiGe thin film structures on Si

January 1, 2015
Author(s)
Mark D. Vaudin, William A. Osborn, Lawrence H. Friedman, Justin M. Gorham, Robert F. Cook, Victor Vartanian
Patterned SiGe thin film structures, heteroepitaxially deposited on Si substrates, are investigated as potential reference standards to establish the accuracy of high resolution electron backscattered diffraction (HR-EBSD) strain measurement methods. The

On the bending strength of single-crystal silicon theta-like specimens

July 10, 2013
Author(s)
Rebecca R. Kirkpatrick, William Alexander Osborn, Michael S. Gaither, Richard S. Gates, Frank W. DelRio, Robert F. Cook
A new theta geometry was developed for micro-scale bending strength measurements. The new "gap" theta specimen was a simple modification of the arch theta specimen that enabled micro-scale tensile testing. The gap theta was demonstrated here on single

Surface mediated assembly of small, metastable gold nanoclusters

May 27, 2013
Author(s)
John M. Pettibone, William A. Osborn, Konrad Rykaczewski, Albert A. Talin, John E. Bonevich, Jeffrey W. Hudgens
The unique properties of metallic nanoclusters are attractive for numerous commercial and industrial applications but are generally less stable than nanocrystals. Thus, developing methodologies for stabilizing nanoclusters and retaining their enhanced