U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications by: Bob R. Keller (Fed)

Search Title, Abstract, Conference, Citation, Keyword or Author
Displaying 51 - 75 of 91

Transmission EBSD in the Scanning Electron Microscope

May 1, 2013
Author(s)
Roy H. Geiss, Katherine P. Rice, Robert R. Keller
A new method for obtaining Kikuchi diffraction patterns from thin specimens in transmission has been developed for use in the SEM, scanning electron microscope, using a conventional electron backscatter diffraction (EBSD) detector and with a slight

Transmission EBSD from 10 nm domains in a scanning electron microscope

March 1, 2012
Author(s)
Robert R. Keller, Roy H. Geiss
The spatial resolution of electron diffraction within the scanning electron microscope (SEM) has progressed from channelling methods capable of measuring crystallographic characteristics from 10 μm regions to electron backscatter diffraction (EBSD) methods

Reliability Testing of Advanced Interconnect Materials

November 10, 2011
Author(s)
Robert R. Keller, Mark C. Strus, Ann C. Chiaramonti Debay, David T. Read, Younglae Kim, Yung J. Jung
We describe the development of electrical test methods to evaluate damage that determines reliability in advanced, small-scale conductors, including damascene copper and aligned carbon nanotube networks. Rapid thermal cycling induced during high-current AC

Electrical Reliability Testing of Single-Walled Carbon Nanotube Networks

May 18, 2011
Author(s)
Mark C. Strus, Ann C. Chiaramonti Debay, Robert R. Keller, Yung J. Jung, Younglae Kim
We present test methods to investigate the electrical reliability of nanoscale lines of highly-aligned, networked, metallic/semiconducting single-walled carbon nanotubes (SWCNTs) fabricated through a template-based fluidic assembly process. We find that

Electromigration of Cu Interconnects Under AC and DC Test Conditions

May 15, 2011
Author(s)
Robert R. Keller, David T. Read, Roey Shaviv, Greg Harm, Sangita Kumari
Electromigration of a 65 nm technology generation test vehicle was measured using DC, AC followed by DC, and three rectangular wave DC stressing conditions at 598 K. In some of the experiments samples were allowed to cool to room temperature between stress

Metrologies for Mechanical Response of Micro- and Nanoscale Systems

January 1, 2008
Author(s)
Robert Keller, Donna C. Hurley, David T. Read, Paul Rice
This chapter describes metrologies developed by NIST scientists and collaborators for mechanical properties of dimensionally-constrained materials; these approaches make use of methods inherently sensitive to small volumes. Attention is focused on

Evaluation of Thin Film Mechanical Properties by Means of Electrical Test Methods

September 30, 2007
Author(s)
Nicholas Barbosa, Robert Keller, David T. Read, Richard P. Vinci
The ability to measure the mechanical properties of thin films and small scale structures is essential in designing reliable components at the micro- and nano-scales. It is known that the mechanical properties of thin film materials deviate from relations

Report of the Workshop on Reliability Issues in Nanomaterials

January 1, 2007
Author(s)
Robert Keller, David T. Read, Roop L. Mahajan
The Workshop on Reliability Issues in Nanomaterials was held at the Boulder Laboratories of the U. S. Department of Commerce on August 17-19, 2004. It was organized by the National Institute of Standards and Technology (NIST) and was designed to promote a

Results of a Nanoindentation Round Robin on Thin Film Copper on Silicon

January 1, 2007
Author(s)
David T. Read, Robert Keller, Nicholas Barbosa, Roy H. Geiss
Nanoindentation is used in a variety of fields to measure material hardness and elastic modulus. This test technique is especially attractive for thin films because of the difficulty of conducting tensile or other conventional mechanical characterization