Sauvageau, J.
, Booi, P.
, Cromar, M.
, Benz, S.
, Burroughs, C.
and Koch, J.
(1995),
Superconducting Integrated Circuit Fabrication Process Utilizing Low Temperature ECR-Based PECVD SiO<sub>2</sub> Dielectric Films, IEEE Transactions on Applied Superconductivity
(Accessed January 2, 2025)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Superconducting Integrated Circuit Fabrication Process Utilizing Low Temperature ECR-Based PECVD SiO2 Dielectric Films
Published
Author(s)
J. E. Sauvageau, P. A. Booi, M. W. Cromar, , ,
Citation
IEEE Transactions on Applied Superconductivity
Volume
5
Issue
2
Pub Type
Journals
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created May 31, 1995, Updated October 12, 2021