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Absolics Inc.
Key Facts
Purpose
The Department of Commerce awarded Absolics Inc. $100 million in direct funding to build a glass-core packaging ecosystem. This award will accelerate domestic research and development (R&D) for glass core substrates and build critical domestic supply chains around Absolics’ state-of-the-art low volume manufacturing facility in Covington, Georgia. The project addresses critical challenges for advanced materials, tools, and design and simulation. Glass substrate prototype devices will integrate and validate the technology throughout the project. Absolic’s Substrate and Materials Advanced Technology (SMART) Packaging Program will engage a large cohort of education and workforce development partners to drive new opportunities for students, graduates, and those already in the workforce through glass substrate-centric curriculum, certifications, and retraining opportunities. Glass-core packaging provides leadership technological advantages in performance, power, scalability, and integration density.
Expected Outcomes
The SMART Packaging Program will execute a comprehensive R&D project plan to meet the aggressive targets set by the team in this project. The existing Absolics glass panel manufacturing capability will rapidly transition R&D into manufacturing. Leading-edge glass core packaging technology will enable numerous commercializations of new technology applications such as digital and RF/mm-wave.
Workforce Development
To support and expand the U.S. semiconductor workforce around glass-core substrates and advanced packaging. Absolics will work with a diverse team of partners to create unique curriculum, industry-recognized certifications/credentials, professional development opportunities, and new programs to support the buildout of a glass substrate packaging ecosystem in the United States.
The team will engage partnerships with the HBCU CHIPS Network to expand participation in the semiconductor industry and microelectronics R&D. Further coordination with regional and national not-for-profit entities will expand education and workforce outcomes nationally.
About the CHIPS National Advanced Packaging Manufacturing Program (NAPMP)
To enable the CHIPS Research and Development Office’s vision for success, the CHIPS NAPMP will make approximately $3 billion in investments to develop critical and relevant innovations for advanced packaging technologies and accelerate their scaled transition to U.S. manufacturing entities. These investments will include research programs for core technologies that can be scaled to high-volume manufacturing, an advanced packaging piloting facility to support this scaling, resources to support the expansion of advanced packaging solutions, and workforce development. As a result, within a decade, NAPMP-funded activities, coupled with CHIPS manufacturing incentives, will establish a vibrant, self-sustaining, high-volume, domestic, advanced packaging industry where advanced-node chips manufactured in the United States are packaged in the United States. The technology developed will be leveraged in new applications and market sectors and at scale.
Financial Summary | Program | CHIPS NAPMP |
Direct Funding Amount | $100 million | |
Expected Co-Investment | $89 million |
Read the full CHIPS for America press release by clicking here.
Learn more about the CHIPS NAPMP by clicking here.