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Notice of Funding Opportunity: CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Materials and Substrates Research and Development
CHIPS for America Announces up to $300 million in Funding to Boost U.S. Semiconductor Packaging
On November 21, 2024, the Biden-Harris Administration announced that the U.S. Department of Commerce (DOC) is entering negotiations to invest up to $300 million in advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry. The expected recipients are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona.
These competitively awarded research investments, each expected to total as much as $100 million, represent novel efforts in advanced substrates. Advanced substrates are physical platforms that allow multiple semiconductor chips to be assembled seamlessly together, enable high-bandwidth communication between those chips, efficiently deliver power, and dissipate unwanted heat. The advanced packaging enabled by advanced substrates translates to high performance computing for AI, next-generation wireless communication, and more efficient power electronics. Such substrates are not currently produced in the United States but are foundational to establishing and expanding domestic advanced packaging capability. Up to $300 million in federal funding will be paired with additional investments from the private sector, bringing the expected total investment across all three projects to over $470 million. This combined effort will help ensure U.S. manufacturers stay competitive and continue to drive technological innovation, giving companies a stronger edge in global competition.
To learn more about the awardees read the full press release here.
On February 28, 2024, CHIPS for America issued a Notice of Funding Opportunity (NOFO) to seek applications for research and development (R&D) activities that will establish and accelerate domestic capacity for advanced packaging substrates and substrate materials, a key technology for manufacturing semiconductors. The CHIPS for America program anticipates approximately $300 million in funding innovation across multiple technologies ranging from semiconductor-based to glass and organics. This is the first NOFO released by the CHIPS for America R&D program office, and the third NOFO released overall by CHIPS for America.
CHIPS National Advanced Packaging Manufacturing Program (NAPMP) Funding Opportunity
Read the full text of the funding opportunity (PDF) for more information.
FAQ: CHIPS R&D Research Security and Technology Protection (PDF)
FAQ: International Engagement in CHIPS R&D Programs (PDF)
Additional Frequently Asked Questions
CHIPS Technology Protection Guidebook (PDF)
CHIPS R&D Commercial Viability and Domestic Production (CVDP) Plan Guidebook (PDF)
NAPMP NOFO 1 Concept Paper Review Process Overview (PDF)
Read more on the vision for the CHIPS NAPMP.
CHIPS NAPMP Funding Opportunity Application Process:
Through this NOFO, the NAPMP program seeks to achieve the following objectives:
- Accelerate domestic R&D and innovation in advanced packaging materials and substrates;
- Translate domestic materials and substrate innovation into U.S. manufacturing, such that these technologies are available to U.S. manufacturers and customers, including to significantly benefit U.S. economic and national security;
- Support the establishment of a robust, sustainable, domestic capacity for advanced packaging materials and substrate R&D, prototyping, commercialization, and manufacturing; and
- Promote a skilled and diverse pipeline of workers for a sustainable domestic advanced packaging industry.
There are two main components to this application:
Mandatory Concept Paper: Applicants will be asked to submit a concept paper. Concept papers were due on April 12, 2024.
- Eligible applicants can only submit one concept plan paper under this NOFO.
- No entity may be included as a subrecipient on more than two concept papers.
- Concept plans received after the deadline will not be reviewed or considered.
Full Application Process: Full proposals were due July 3, 2024.
- Full applications will only be accepted from applicants who were invited to submit a full application after review of their mandatory concept paper.
Additional resources for the advanced packaging substrates and substrate materials funding opportunity:
Learn about additional CHIPS for America R&D funding opportunities.