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CHIPS R&D Funding Opportunities
The CHIPS for America Research and Development Office is responsible for administering $11 billion to advance U.S. leadership in semiconductor research and development (R&D) through four programs:
- The CHIPS National Semiconductor Technology Center (NSTC) Program
- The CHIPS National Advanced Packaging Manufacturing Program (NAPMP)
- The CHIPS Metrology Program
- The CHIPS Manufacturing USA Program
CHIPS for America has released the following Notice of Funding Opportunities (NOFO) for CHIPS R&D Programs:
October 30, 2024: NOFO: CHIPS AI/AE for Rapid, Industry-informed Sustainable Semiconductor Materials and Processes (CARISSMA) Competition
The U.S. Department of Commerce issued a NOFO for activities that will use cutting-edge artificial intelligence (AI) and autonomous experimentation (AE) technologies to support the long-term viability of next-generation semiconductor manufacturing.
CHIPS for America anticipates that the total Federal funds available under CARISSMA will be up to approximately $100 million with individual awards ranging from approximately $20 million to $40 million.
Expected participants include teams of universities and other research entities with significant experience in artificial intelligence-powered autonomous experimentation (AI/AE); semiconductor industry partners; emerging research institutions; and civil society organizations focused on environmental sustainability or human health and safety
Concept papers were due on January 13, 2025.
October 18, 2024: NOFO: CHIPS National Advanced Packaging Manufacturing Program (NAPMP)
- The U.S. Department of Commerce issued a NOFO to seek proposals for new R&D activities that will establish and accelerate domestic capacity for semiconductor advanced packaging.
- CHIPS for America anticipates making available up to approximately $1.6 billion for funding multiple awards across five R&D areas with the potential for follow-on funding for prototyping activities.
- The five R&D areas are:
- Equipment, tools, processes, and process integration
- Power delivery and thermal management
- Connector technology, including photonics and radio frequency (RF)
- Chiplets ecosystem
- Co-design/electronic design automation (EDA)
- Concept papers were on December 20, 2024. Concept papers received after this deadline will not be reviewed or considered.
May 5, 2024: NOFO: CHIPS Manufacturing USA institute
Update: On January 3, 2025, CHIPS for America awarded the Semiconductor Research Corporation Manufacturing Consortium Corporation (SRC) $285 million to establish and operate a Manufacturing USA institute headquartered in Durham, North Carolina. Learn more about the award here.
February 28, 2024: NOFO: CHIPS NAPMP Materials and Substrates Research and Development
- Update: On January 16, 2025, the Department of Commerce (DOC) awarded a total of $300 million for advanced packaging research projects in Georgia, California, and Arizona to accelerate the development of cutting-edge technologies essential to the semiconductor industry. The recipients are Absolics Inc. in Georgia, Applied Materials Inc. in California, and Arizona State University in Arizona. Read the full press release here.
Resources
A fact sheet on the CHIPS Manufacturing USA institute NOFO can be found here.
A fact sheet on the CHIPS NAPMP NOFO can be found here.
Learn more about the CHIPS Metrology SBIR NOFO here.
CHIPS R&D Commercial Viability and Domestic Production (CVDP) Plan Guidebook (PDF)
CHIPS R&D Education and Workforce Development (EWD) Plan Guidebook
For questions, please email askchips [at] chips.gov (askchips[at]chips[dot]gov).