CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility

Purpose

The CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility, is expected to be located the Arizona State University (ASU) Research Park in Tempe, Arizona. The PPF will enable researchers and industry leaders to develop and test new materials, devices, and advanced packaging solutions in a state-of-the-art R&D environment. This newly constructed facility is expected to be operational in 2028 and will play a key role in driving U.S. leadership in semiconductor innovation, economic growth, and national security.

Activities to be Performed

The PPF’s prototyping capabilities will consist of at least one 300mm full-flow complementary metal-oxide-semiconductor (CMOS) technology as a stable baseline for experiments. The facility will also allow for a variety of R&D in a manufacturing-like environment that would not be feasible at a manufacturing site, including novel materials and device architectures.

Key packaging capabilities are expected to include a baseline advanced packaging piloting line to enable the development and commercialization of new packaging processes. The facility will also support U.S. workforce development efforts by providing opportunities for collaborative, hands-on research utilizing industry-leading tools and equipment.

Expected Outcomes

As a key part of President Biden’s Investing in America agenda, CHIPS for America is driven by the growing need to bolster the U.S. semiconductor supply chain, accelerate U.S. leading-edge R&D, and create good quality jobs around the country.

As one of three CHIPS R&D flagship facilities, the PPF will be amplified by Arizona’s robust and growing microelectronics landscape, including leading front-end semiconductor manufacturing and advanced packaging companies, and a vibrant university research environment. The expected partnership with ASU will jumpstart R&D in these areas and leverage the substantial programs underway at the university. 

Combined with the previously announced EUV Accelerator and Design and Collaboration Facility, the CHIPS for R&D flagship facilities will establish world-class destinations for advanced semiconductor R&D in the United States. They will address critical gaps in the current ecosystem, offering unparalleled value to a diverse array of stakeholders across the semiconductor value chain, including universities, small businesses, large manufacturers, and government agencies, and help build vibrant semiconductor ecosystems in the U.S. that bolster cutting-edge R&D and create quality jobs. 

About the National Semiconductor Technology Center

Natcast is the purpose-built, non-profit entity created to operate the National Semiconductor Technology Center (NSTC), established by the CHIPS and Science Act of the U.S. government. The NSTC is a public-private consortium dedicated to semiconductor R&D in the United States. A key component of the CHIPS Act, the NSTC will convene the U.S. government, allied and partner nations, and organizations across the semiconductor ecosystem—including academia and businesses of all kinds—to address the most challenging barriers to continued technological progress in the domestic semiconductor industry, including the need for a capable workforce. The NSTC reflects a once-in-a-generation opportunity for the U.S. to drive the pace of innovation, set standards, and re-establish global leadership in semiconductor design and manufacturing.