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Laser Thermal Analysis, Inc.
Key Facts
Purpose
Laser Thermal Analysis, Inc. aims to build a hybrid Atomic Force Microscopy-thermoreflectance (AFM-TR) instrument to generate maps of the thermal resistance, thermal boundary interface resistance, and temperature profiles of microprocessors and wide bandgap semiconductor materials and devices with < 100 nm spatial resolution, < 0.5 ºC temperature resolution, < 10 % measurement uncertainty, and capability of characterizing materials without the need for an applied transducer coating. This thermal metrology tool will be automated, user-friendly, and low cost to operate.
Activities to be performed
The researcher will demonstrate the ability of the instrument to conduct thermophysical property measurements and then will construct and deliver an automated and user-friendly system.
Expected Outcomes
The instrument will streamline system functionality for ease of operation and lower operational cost, while maximizing measurement throughput.
Intended Beneficiaries
Researchers and the U.S. semiconductor industry who make devices with thermal management issues and materials development needs on length scales smaller than 100 nanometers.
Subrecipient Activities
The recipient plans to subaward funds for activities such as tip development and coating, data management and data processing.