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The Microprocess Technology Avenger spray solvent lift-off tool uses a heated spray solvent to remove residual material and photoresist after deposition of a
The Nanonex NX-2000 Nanoimprinter provides users with the capability to replicate surface patterns with feature sizes down to 10 nm over large areas at a low
The Nikon L200 is a compound optical microscope that supports both reflected light and transmitted light modes for inspecting substrates and samples. The
The Oxford Plasmalab 100 inductively coupled plasma (ICP) etcher is a multipurpose fluorocarbon based system that provides users anisotropic etching of silicon
The Oxford Plasmalab 100 inductively coupled plasma (ICP) etcher is a multipurpose chlorine based system that provides users with selective etching of III-V
The Oxford PlasmaLab 100 is a plasma-enhanced chemical vapor deposition (PECVD) system used to deposit a variety of thin films on to a substrate material. The
The Oxford PlasmaPro100 ICP etcher is configured for etching of III-V group semiconductors (InP and GaAs) using a chlorine gas-based plasma etch chemistry. The
The Plasma-Therm Versaline high density plasma enhanced chemical vapor deposition (HD-PECVD) system uses an inductively coupled plasma to remotely ionize
The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch
The Reynolds Tech silicon nitride etch wet bench uses dilute phosphoric acid to preferentially etch silicon nitride on silicon. The process is used to define
The Specialty Coating Systems PDS 2010 parylene deposition system provides users with reliable and repeatable conformal parylene coatings ranging from 75
The SPTS µEtch is a single wafer hydrofluoric acid vapor etcher used to release silicon microstructures in microelectromechanical systems (MEMS) devices. It
The SPTS Omega c2L Rapier deep silicon etcher is an inductively coupled plasma (ICP) etching system used for etching deep features in silicon. The tool uses a
The Suss MicroTec ACS200 is an automated photoresist coating and baking station with cassette-to-cassette substrate operation. It supports both spin coating and
The Suss MicroTec Delta12AQ is an automated photoresist developer station which supports temperature controlled spray photoresist development. The cassette-to
The SUSS MicroTec MA/BA6 contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 1 µm. The tool
The Toho Technology FLX-2320 stress measurement tool uses a laser interferometer to measure the curvature of a wafer before and after film deposition. It then
The Tousimis Supercritical Automegasamdri-916B Series C critical point dryer uses liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in
The Tresky T-3000-FC3-HF flip chip bonder can dispense solder pastes and epoxies, place solder preforms, and bond various types of devices onto semiconductor
The Unaxis Shuttleline inductively coupled plasma (ICP) etcher is a general purpose chlorine reactive ion etcher. The high power ICP source combined with low
The Unaxis Shuttleline DSEII deep silicon etcher is an inductively coupled plasma (ICP) etching system used for etching deep features in silicon. The tool uses
The Xactix Xetch is a single wafer tool which isotropically etches silicon using vapor phase xenon difluoride. The xenon difluoride etch process provides high
The Zeiss Gemini 500 Field Emission Scanning Electron Microscope (FE-SEM) is a high resolution FE-SEM which provides nanoscale imaging from 100 mm diameter
The Zeiss Gemini 560 Field Emission Scanning Electron Microscope (FE-SEM) is a high resolution FE-SEM which provides nanoscale imaging from 100 mm diameter
The Zeiss Ultra 60 Field Emission Scanning Electron Microscope (FE-SEM) is a high resolution FE-SEM which provides nanoscale imaging and compositional analysis