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The Unaxis 790 reactive ion etcher (RIE) is a general purpose parallel plate plasma etching system which uses ionized fluorocarbon gases and oxygen to etch
This PlasmaTherm 790 reactive ion etcher (RIE) is a parallel plate plasma etching system which uses fluorocarbon and oxygen gases to etch silicon nitride thin
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to processing in high temperature furnaces
The Reynolds Tech silicon etch wet bench uses dilute potassium hydroxide (KOH) to preferentially etch silicon along the material's crystal planes. The process
The Rigaku SmartLab X-ray diffraction system (XRD) is a fully automated, modular system for advanced x-ray diffraction measurements on a wide range of materials
The two Sandvik anneal furnaces, equipped with silicon carbide tubes, support anneal processing in the NanoFab. The anneal furnaces allow nitrogen, argon and
The Sandvik low pressure chemical vapor deposition (LPCVD) of silicon oxide furnace supports low temperature oxide (LTO) on substrates ranging from small chips
The two Sandvik low pressure chemical vapor deposition (LPCVD) silicon nitride furnaces support stoichiometric and low stress silicon nitride deposition on
The two Sandvik oxidation furnaces, equipped with silicon carbide tubes, support oxidation processing in the NanoFab. The oxidation furnaces support thermal wet
The Semitool PSC-101 spin rinse dryer uses deionized water to rinse and heated nitrogen to dry whole wafer substrates automatically after wet chemical processes
The Silanization Oven is available to users in the Soft Lithography Laboratory. This tool supports the mold adhesion and release processes using organosilanes
The SSEC model 3300ML single wafer spray acid cleaning system supports general SC1 and Piranha processes in the NanoFab cleanroom. This system mixes, heats and
The SSEC model 3300ML single wafer spray acid cleaning system supports high purity SC1 and Piranha processes in the NanoFab cleanroom. This system mixes, heats
The SSEC model 3300ML single wafer spray acid cleaning system supports RCA process in the NanoFab cleanroom. This system mixes, heats and delivers chemicals on
The Suss MicroTec SB6 Gen2 wafer bonder is a substrate bonder that’s equipped to handle a wide range of substrate bonding processes. The bonder accommodates
The Denton “Bench Top Turbo” thermal evaporator is a single source evaporator equipped with substrate rotation, a thickness monitor, and automatic deposition
The Tousimis Supercritical Autosamdri-815 Series B critical point dryer utilizes liquid carbon dioxide (LCO 2) to dry substrates in a controlled manner in order
The Near Edge X-ray Absorption Fine Structure (NEXAFS) experimental stations uses a tunable, focused monochromatic beam of soft X-rays (0.1 keV to 2.2 keV) to
Summary The NIST Neutron Imaging Facility provides users with a unique “plug and play” approach to imaging operating fuel cells, electrolyzers, and lithium-ion
The Neutron Interferometry and Optics Facilities (NIOFs) are the World's premier facilities for neutron interferometry and related optical measurements. Neutron
We currently use a high resolution (0.1 cm -1) Nicolet Nexus 670 that is flexible in both its current iteration and is upgradeable for future needs. The optics