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The Zeiss Ultra 60 Field Emission Scanning Electron Microscope (FE-SEM) is a high resolution FE-SEM which provides nanoscale imaging and compositional analysis
The 4Wave IBE-20B ion milling system uses a broad argon ion beam to controllably and uniformly remove material from a user's substrate. A secondary ion mass
The ABM contact aligner allows users to align patterns on the front or back of a substrate and to print feature sizes down to 800 nm. The tool offers vacuum
The ADT 7132 dicing saw is used to cut multi-device substrates into individual chips. The system can accommodate substrates up to 4 mm thick and supports sizes
The AllWin21 Downstream plasma asher uses heat and exposure to downstream oxygen radicals to remove resist and other organic materials. The cassette load system
The AnnealSys model AS-Master is a single wafer rapid thermal process system supports anneal processing in the NanoFab cleanroom. This tools supports anneals
The ASML PAS 5500/275D is a high throughput i-line stepper. It utilizes 5X reduction and projection capability with step and repeat to transfer photomask
The Oxford FlexAL atomic layer deposition (ALD) system supports plasma and thermal ALD coating processes with precise ultrathin and pinhole free films. The
The Bruker Dektak XT contact profilometer measures the thin film thickness of patterned features by sensing the deflection of a fine stylus that is raster
The CEE Apogee is a resist spinner system. The tool is used to uniformly apply photoresist on substrates ranging from 200 mm diameter wafers down to small
The Envirco 1.8 m laminar hood provides soft lithography lab users a clean environment to perform final assembly processes on PDMS samples. The hood is capable
The Filmetrics F40-UV reflectometer provides users with rapid thin film thickness and optical constants measurements on most common device film stacks. The F40
The Arradiance Gemstar atomic layer deposition (ALD) system supports thermal ALD coating processes with precise ultrathin and pinhole free films in a compact
This tool removes the particulate residues resulting after wafer polishing using the CMP. These particles are typically a few tens of nanometers in size. The
The Harrick Plasma PDC-32 plasma bonder is used to remove fine particles on user substrates prior to release agent treatment and to modify the surface bonds of
The MLA150 has been specifically designed for direct-wafer writing and easy operation. It offers all the capabilities that are required for single layer and
The Lattice Gear LatticeAx cleaving tool is used for highly accurate, manual cleaving of substrates. The system is an indenting and cleaving tool that produces
The Leica EM GP automatic plunge freezer uses the bare grid technique to prepare vitrified fluid specimens for analysis in the transmission electron microscope
The Four Dimensions CV92A mercury probe system provides non-destructive and rapid measurement of current-voltage and capacitance-voltage curves to derive
The CorSolutions microfluidic test station consists of a digital microscope, PneuWave pneumatic pump, and microfluidic probes to enable non-destructive, rapid
The microwave plasma system is used for photoresist descum/removal and wafer cleaning. The system is equipped with a hand free door opening system for easy
The Nikon SMZ1500 is a long working distance stereo microscope that supports both reflected light and transmitted light modes for inspecting substrates and
The Olympus SZH10 is a long working distance stereo microscope that supports both reflected light and transmitted light modes for inspecting substrates and
The CNST NanoFab PDMS casting station consists of a Hamilton Safeaire fume hood which houses a Smart Coater 100 spinner, a Dataplate digital hot plate, an Ohaus
The Reynolds RCA wet bench is used to remove organic and metal contamination from the surfaces of substrates prior to high temperature furnace processing. The