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Ari Feldman (Fed)

Chief of the RF Technology Division

Ari D. Feldman received his B.S. in Engineering Physics in 2006 and Ph.D. in Materials Science in 2012 from the Colorado school of Mines, Golden, CO, USA. His doctoral thesis involved the study of anomalous photoconductive decay behavior in silicon under high-optical-injection conditions. In the Fall of 2013, he was awarded the National Research Council Post-Doctoral Fellowship and joined the High-Speed Measurements Group at the National Institute of Standards and Technology (NIST) to develop high-speed photodetectors as high-frequency phase references and research electro-optic sampling techniques. In 2019, he became the Group Leader for the High-Speed Measurements Group and Project Leader for the Waveform Metrology Project. In 2023, he became the Chief of the RF Technology Division at NIST, overseeing delivery of RF calibrations and research on advanced communications technologies (over-the-air, high-frequency on-wafer devices, quantum communications and sensors). His research interests include on-wafer metrology, electro-optic sampling, high-speed photodetectors, and integrated photonics. 

Awards

2013 NRC Postdoc

2017 Department of Commerce Gold Award for the NASCTN LTE Impacts on GPS

Publications

Characterizing interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and

Demonstrating Broadside-Coupled Coplanar Waveguide Interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips
Created March 27, 2019, Updated October 3, 2024