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Notice of Funding Opportunity: CHIPS NAPMP
On October 18, 2024, the U.S. Department of Commerce issued a Notice of Funding Opportunity (NOFO) to enable the United States semiconductor industry to adopt innovative new advanced packaging flows for semiconductor technologies. CHIPS for America anticipates making available up to approximately $1.6 billion for funding multiple awards across five research and development (R&D) areas with the potential for follow-on funding for prototyping activities.
The five R&D areas are:
- Equipment, Tools, Processes, and Process Integration
- Power Delivery and Thermal Management
- Connector Technology, Including Photonics and Radio Frequency (RF)
- Chiplets Ecosystem
- Co-design/Electronic Design Automation (EDA)
CHIPS NAPMP Funding Opportunity Application Process:
Mandatory Concept Paper:
Applicants were asked to submit a concept paper which was due at 11:59 p.m. Eastern Time, December 20, 2024.
Eligible applicants may submit only one concept paper per R&D Area. However, applicants may submit separate concept papers on different R&D Areas.
Concept plans received after the deadline will not be reviewed or considered.
Full Application Process:
Full applications will only be accepted from applicants who are invited to submit a full application after review of their mandatory concept paper.
Invited applicants will have 60 days from the date of invitation to submit a full application. Applicants with questions about their deadline can email research [at] chips.gov (research[at]chips[dot]gov) with “2025-NIST-CHIPS-NAPMP-01 Deadline” in the subject line.