Flip Chip Lamination to electrically contact organic single crystals on flexible substrates

Published

April 20, 2011

Author(s)

Oana Jurchescu, Brad Conrad, Christina Hacker, David J. Gundlach, Curt A. Richter

Abstract

The fabrication of top metal contacts for organic electronics represents a challenge and has important consequences for electrical properties of such systems. We report a low cost and non-destructive printing process, Flip Chip Lamination (FCL), to fabricate top contacts on rubrene single crystals on flexible plastic substrates. Surface chemistry treatments using fluorinated self-assembled monolayers combined with moderate heat and pressure allow conformal lamination of gold contacts onto rubrene single crystals. I-V characteristics of rubrene with FCL top contact and bottom bonded contacts suggests better quality at the interface compared to the analogue architecture of e-beam evaporated top contacts.

Citation

Applied Physics Letters

Volume

98

Pub Type

Journals

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Keywords

organic electronics, flip-chip lamination, electronic contacts, organic-inorganic interface

Citation

Jurchescu, O. , Conrad, B. , Hacker, C. , Gundlach, D. and Richter, C. (2011), Flip Chip Lamination to electrically contact organic single crystals on flexible substrates, Applied Physics Letters, [online], https://tsapps.nist.gov/publication/get_pdf.cfm?pub_id=907524 (Accessed November 23, 2024)