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Aaron Hagerstrom (Fed)

Publications

A low-cost ultrasonic absorption spectrometer mainly using off-the-shelf parts

Author(s)
Michelle Crouse, Malgorzata Musial, Jason Widegren, Jacob Pawlik, Bryan Bosworth, Nathan Orloff, Aaron Hagerstrom, Angela Stelson, Robert Lirette
Ultrasonic absorption spectroscopy can probe intermolecular interactions that inform research into chemical engineering and pharmaceutical manufacturing

Characterizing interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and

Traceable RF Power Metering Procedures With Thermoelectric Sensors

Author(s)
Zenn Roberts, Aaron Hagerstrom, Cole Gray, Angela Stelson, Vincent Neylon, Christian Long
The National Institute of Standards and Technology (NIST) maintains the United State's primary standards for traceable RF and mm-wave power measurements. These

Demonstrating Broadside-Coupled Coplanar Waveguide Interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips
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Created September 24, 2019, Updated December 8, 2022