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Alexander Landauer (Fed)

Alex Landauer (he/him; ORCID: 0000-0003-2863-039X) is an experimental solid mechanician in the Security Technologies Group. Alex specializes in full-field measurements in mechanics across domains including soft materials, impact protection, 3D printing, semiconductors and cell mechanobiology. Methods include commercial off-the-shelf and custom instruments such as universal testing systems, dynamic mechanical analysis, drop tower impact, and optical imaging systems. Full-field measurement strategies focus on 2D, surface-3D and volumetric digital image correlation (DIC/DVC), particle image velocimetry and single particle tracking (PIV and PTV/SPT), in addition to other image analysis modalities. These enable advanced technique such as light field microscopy (LFM) and traction force microscopy (TFM) measurements, computational methods including finite element model updating (FEMU) and constitutive model fitting routines, and provide key data and diagnostics for material characterization.

Overall, Alex's experimental and computational capabilities build toward an experimental mechanics program that incorporates sophisticated force application and imaging, deformation reconstruction, inverse property identification, machine learning (ML) and constitutive modeling techniques for material measurement and characterization. His interests involve developing experimental systems and techniques to explore and model materials, structure-property relationships, and understand uncertainty and error sources. Alex's collaborative approach and commitment to open software and data strives to help material and physical scientists, biomedical engineers, materials manufacturers, and protective equipment developers understand and design highly performant systems.

Warning: Alex's twin brother Orion Kafka is also a research engineer in MML at the Boulder site and confusion is possible. 

Research Interests

  • Non-contact deformation tracking (DIC/DVC/PIV, PTV and SPT) and uncertainty quantification
  • Material modeling for soft, elastomeric and porous materials, including hierarchical and lattice-like engineered materials
  • Mechanical measurements with advanced optics for biological systems and in situ experiments (LFM and TFM)  
  • Combining experimental techniques and computation (FEMU, virtual fields methods, ML for material science)
  • Material systems for impact protection and mitigation strategies

Ongoing projects

(Principal NIST collaborators are mentioned parenthetically.)

  • Accurate Cure Kinetics, Stress, Mechanical Properties and Warpage: Focusing on DIC for cure shrinkage and wafer- or package-level warpage measurements in a CHIPS funded project (collaboration with MSED and BBD)
  • Impact mitigating materials: Developing measurement techniques and exploring material response for impact-like loading scenarios using tools including an instrumented drop tower and servo-hydraulic load frame with high-speed cameras and Digital Image Correlation (DIC), dynamic mechanical analysis, and micro-computed tomography (with ACMD collaborators Newell Moser and Orion Kafka)
  • Material characterization to support the development of polymer additively manufactured sheet metal press brake forms (with Jon Seppala and Mark Iadicola from MSED, and Aaron Forster)
  • Full-field uncertainty estimation for 2D-DIC using deep learning
  • Drop tower based experimental design for material characterization (with Ran Tao and Michael Riley)
  • Single-fiber Kolsky bar testing of high-strength fibers to assess effect of artificial ageing and strain rate on ballistic performance (with Amanda Forster and external collaborators)

Recent Conference Presentations

  • Landauer A.K., Faisal A., Adamy W., Goodge K.E., Forster A.L., Engelbrecht-Wiggans A., Paulter N.G., "Dynamic viscoelasticity of single fibers and fiber bundles via stress-relaxation Kolsky bar tension", Society for Experimental Mechanics, Jun, 2024.
  • Landauer A.K ., Seppala J.E., Foster, A.M., "Material properties measurements of stereolithographic glass-filled polymer prints for forming tool prototypes", ASTM International Conference on Advanced Manufacturing. Nov, 2023.
  • Landauer A.K. "Dataset Generation for Digital Image/Volume Correlation and Particle Tracking: Applications to Machine Learning-Based Techniques", Society of Engineering Science Annual Conference. Oct, 2023.

     

Awards

  • NIST MML Early Career Researcher "Accolade" (Material Measurement Laboratory, 2023).
  • SEM Hetenyi Best Paper in 2022 Award (Experimental Mechanics, 2023) 
  • NIST NRC Postdoctoral Research Associateship (National Research Council, Awardee, 2019)
  • International Student Paper Competition (Society of Experimental Mechanics, Finalist, 2018)
  • Graduate Research Fellowship (National Science Foundation, Program Fellow, 2015-2020)
  • James R Rice Graduate Fellowship in Solid Mechanics (Brown University, 2014-2015)

Selected Publications

SerialTrack: ScalE and Rotation Invariant Augmented Lagrangian Particle Tracking

Author(s)
Jin Yang, Yue Yin, Alexander Landauer, Selda Buyukozturk, Jing Zhang, Luke Summey, Alexander McGhee, Matthew Fu, John Dabiri, Christian Franck
We present a new particle tracking algorithm to accurately resolve large deformation and rotational motion fields, which takes advantage of both local and

DIC Challenge 2.0: Developing Images and Guidelines for Evaluating Accuracy and Resolution of 2D Analyses: Focus on the Metrological Efficiency Indicator

Author(s)
Philip Reu, EMC Jones, S.S. Fayad, B. Blaysat, E. Toussaint, Mark Iadicola, P. Lava, J Rethore, J. Yang, K. Bhattacharya, L. Yang, D. Deb, C.S.R. Vemulapati, M Klein, E Ando, E Roubin, O. Stamati, C Couture, Alexander Landauer, M. Liu, S Jaminion, T. Siebert, S.N. Olufsen
Background The DIC Challenge 2.0 follows on from the work accomplished in the first Digital Image Correlation (DIC) Challenge Reu et al. (Experimental Mechanics

Publications

Created December 8, 2019, Updated September 24, 2024