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Dylan Williams (Fed)

Electrical Engineer

Dylan F. Williams received a Ph.D. in Electrical Engineering from the University of California, Berkeley in 1986. He joined the Electromagnetic Fields Division of the National Institute of Standards and Technology in 1989 where he develops electrical waveform and microwave metrology. He has published over 80 technical papers and is a Fellow of the IEEE. He is the recipient of the Department of Commerce Bronze and Silver Medals, two Electrical Engineering Laboratory's Outstanding Paper Awards, two Automatic RF Techniques Group (ARFTG) Best Paper Awards, the ARFTG Automated Measurements Technology Award, and the IEEE Morris E. Leeds Award. Dylan is now Editor of the IEEE Transactions on Microwave Theory and Techniques.

Publications


Related Programs and Projects

High Speed Waveform Measurement

  • Electrooptic Sampling and Waveform Measurement

 On-Wafer Measurement Metrology

Metrology for Electronic Packaging

 

Publications

Characterizing interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Meagan Papac, Aaron Hagerstrom, Eric Marksz, Jerome Cheron, Angela Stelson, Florian Bergmann, Ari Feldman, Dylan Williams, Christian Long, Nathan Orloff
We developed an interconnect characterization procedure that first embeds the interconnect into the error boxes of a multiline thru-reflect-line calibration and

Demonstrating Broadside-Coupled Coplanar Waveguide Interconnects to 325 GHz

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
State-of-the-art integrated circuits leverage dissimilar materials to optimize system performance. Such heterogeneous integration often involves multiple chips

A Distributed Theory for Contactless Interconnects at Terahertz Frequencies

Author(s)
Nicholas Jungwirth, Bryan Bosworth, Aaron Hagerstrom, Meagan Papac, Eric Marksz, JEROME CHERON, Kassiopeia Smith, Angela Stelson, Ari Feldman, Dylan Williams, Nathan Orloff, Christian Long
Here we test a multimodal model for distributed contactless interconnects by comparing it to 3D full-wave simulations. In comparison to 3D simulations, the

Patents (2018-Present)

Created March 13, 2019, Updated December 9, 2022