Kopanski, J.
, Blackburn, D.
, Harman, G.
and Berning, D.
(1991),
Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits, Proc., First International High Temperature Electronics Conference, Albuquerque, NM, USA
(Accessed November 8, 2024)
Official websites use .gov
A .gov website belongs to an official government organization in the United States.
Secure .gov websites use HTTPS
A lock (
) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.
Assessment of Reliability Concerns for Wide-Temperature Operation of Semiconductor Devices and Circuits
Published
Author(s)
, , ,
Proceedings Title
Proc., First International High Temperature Electronics Conference
Conference Dates
June 16-20, 1991
Conference Location
Albuquerque, NM, USA
Pub Type
Conferences
Citation
Issues
If you have any questions about this publication or are having problems accessing it, please contact reflib@nist.gov.
Created December 30, 1991, Updated October 12, 2021