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Search Publications by: Richard A. Allen (Fed)

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Displaying 51 - 75 of 269

A ROUND ROBIN EXPERIMENT TO PROVIDE PRECISION AND BIAS FOR SEMI MS5: TEST METHOD FOR WAFER BOND STRENGTH MEASUREMENTS USING MICRO-CHEVRON TEST STRUCTURES

December 7, 2009
Author(s)
Richard A. Allen, Winthrop A. Baylies, Paul Langer, Ralph Danzl, Frank W. DelRio, Gavin Horn, Roy Knechtel, Michael Mattes, David T. Read, Sumant Sood, Kevin T. Turner
An international round robin was organized to update SEMI Standard MS5: Test Method for Wafer Bond Strength Measurements using Micro-Chevron Test Structures. Results from the round robin allowed for inclusion of a Precision and Bias statement. The new

Mobile Microrobot Characterization through Performance-Based Competitions

November 19, 2009
Author(s)
Jason J. Gorman, Craig D. McGray, Richard A. Allen
Recent advances in the design and fabrication of microelectromechanical systems (MEMS) have enabled the development of mobile microrobots that can autonomously navigate and manipulate in controlled environments. It is expected that this technology will be

Nanoindentation of Si Nanostructures: Buckling and Friction at Nanoscales

September 18, 2009
Author(s)
Huai Huang, Bin Li, Qiu Zhao, Zhiquan Luo, Jay Im, Min Kang, Richard A. Allen, Michael W. Cresswell, Rui Huang, Paul S. Ho
A nanoindentation system was employed to characterize mechanical properties of silicon nanolines (SiNLs), which were fabricated by an anisotropic wet etching (AWE) process. The SiNLs had the linewidth ranging from 24 nm to 90 nm, having smooth and vertical

MEMS in Action: RoboCup Nanogram 2009

August 1, 2009
Author(s)
Richard A. Allen, Craig D. McGray
From June 29 through July 5, 2009 teams from around the world participated in the International RoboCup competition, held in Graz, Austria. In addition to humanoid robots playing soccer on turf fields, companion robots demonstrating their ability to help

Indentation of Single-Crystal Silicon Nanolines: Buckling and Contact Friction at Nanoscale

April 8, 2009
Author(s)
Bin Li, Qiu Zhao, Huai Huang, Zhiquan Luo, Jay Im, Michael W. Cresswell, Richard A. Allen, Min K. Kang, Rui Huang, Paul S. Ho
Silicon nanostructures are essential building blocks for nanoelectronic devices and nano-electromechanical systems (NEMS). Mechanical characterization at nanoscale is important for practical applications but remains challenging as the mechanical properties

Controlled Formation and Resistivity Scaling of Nickel Silicide Nanolines

February 25, 2009
Author(s)
Bin Li, Zhiquan Luo, Paul S. Ho, Li Shi, Lew Rabenberg, JiPing Zhou, Richard A. Allen, Michael W. Cresswell
We demonstrate a top-down method to fabricate nickel mono-silicide (NiSi) nanolines with smooth side walls and linewidths down to 15 nm. Four probe electrical measurements revealed that the electrical resistivity at room temperature remained constant as

Comparison of Measurement Techniques for Linewidth Metrology on Advanced Photomasks

February 19, 2009
Author(s)
Stewart Smith, Andreas Tsiamis, Martin McCallum, Andrew Hourd, J Stevenson, Anthony Walton, Ronald G. Dixson, Richard A. Allen, James E. Potzick, Michael W. Cresswell, Ndubuisi George Orji
This paper compares electrical, optical, and atomic force microscope (AFM) measurements of critical dimension (CD)made on a chrome on quartz photomask. Test structures suitable for direct, on-mask electrical probing have been measured using the above three