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Search Publications by: Wen-Li Wu (Assoc)

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Displaying 1 - 25 of 386

Additive-Containing Rinses for LER and Defectivity Control During High-Resolution Resist Patterning

October 12, 2021
Author(s)
D L. Goldfarb, S D. Burns, M Angelopolous, S Skordas, R L. Burns, M C. Lawson, C J. Brodsky, V Vishnu, E Jablonski, Vivek Prabhu, Ronald L. Jones, B D. Vogt, Christopher Soles, Eric K. Lin, Wen-Li Wu
The addition of a surface conditioning agent to the de-ionized water rinse used to quench the photoresist development process is an attractive methodology that can afford a controlled decrease in resist line edge roughness (LER) or a reduction in

Chemically Amplified Photoresists Fundamental Properties and Limits of Applicability to Sub-100 nm Lithography

October 12, 2021
Author(s)
D M. Goldfarb, Eric K. Lin, Christopher Soles, B C. Trinque, S D. Burns, Ronald L. Jones, Joseph~undefined~undefined~undefined~undefined~undefined Lenhart, M Angelopoulos, C G. Wilson, Sushil K. Satija, Wen-Li Wu
State-of-the-art lithographic technologies combine chemically amplified photoresists and sophisticated radiation sources to delineate patterned areas with high spatial resolution, enabling the fabrication of continually decreasing feature sizes in the

Determination of the Complex Modulus of a Supported Ultra-Thin Polymer Film

October 12, 2021
Author(s)
Christopher C. White, Wen-Li Wu
A novel technique to quantitatively measure the complex modulus of ultra-thin polymer films (sub micron) is described. This technique employs a new mechanical impedance expression developed from a two-layer viscoelastic media model. This result is combined

Low Dielectric Constant Nanocomposite Thin Films Based on Silica Nanoparticle and Organic Thermosets

October 12, 2021
Author(s)
Q Lin, Stephen Cohen, Lynne Gignac, Brian Herbst, David Klaus, Eva Simonyi, Jeffrey Hedrick, John Warlaumont, Hae-Jeong Lee, Wen-Li Wu
Low dielectric constant (low-k) nanocomposite thin films have been prepared by spin coating and thermal cure of solution mixtures of two organic low-k thermoset pre-polymers and a silica nanoparticle with an average diameter of about 8nm. The electrical

Understanding Deviations in Lithographic Patterns Near Interfaces: Characterization of Antireflective Coatings (ARC) and the ARC/Resist Interface

October 12, 2021
Author(s)
Joseph~undefined~undefined~undefined~undefined~undefined Lenhart, Daniel A. Fischer, S Sambasivan, Eric K. Lin, Wen-Li Wu, Douglas Guerrero, Yijun Wang, R Puligadda
Interactions between a bottom anti-reflective coating (BARC) and a photo-resist can critically impact lithographic patterns. For example, a lithographic pattern can shrink or spread near a BARC interface, a process called undercutting or footing

Electron Reflectometry for Measuring Nanostructures on Opaque Substrate

July 8, 2019
Author(s)
Lawrence H. Friedman, Wen-Li Wu
Here, we present a method for measuring dimensions of nanostructures using specular reflection of electrons from an opaque surface. Development of this method has been motivated by measurement needs of the semiconductor industry, but it can also be more

X-ray Metrology for the Semiconductor Industry Tutorial

February 1, 2019
Author(s)
Daniel F. Sunday, Wen-Li Wu, Scott Barton, Regis J. Kline
The semiconductor industry is in need of new, in-line dimensional metrology methods with higher spatial resolution for characterizing their next generation nanodevices. The purpose of this short course is to train the semiconductor industry on the NIST

Characterization of Buried Structure in Directed Self Assembly Block Copolymers

July 30, 2014
Author(s)
Daniel F. Sunday, Matthew R. Hammond, Chengqing C. Wang, Wen-Li Wu, Dean M. DeLongchamp, Regis J. Kline, Melia Tjio, Joy Cheng, Jed W. Pitera
The directed self assembly (DSA) of block copolymers (BCP) can multiply or subdivide the pitch of a lithographically defined chemical or topological pattern and is a resolution enhancement candidate to augment conventional lithography for patterning sub-20