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Search Publications by: Daniel Wheeler (Fed)

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Displaying 76 - 100 of 106

Superconformal Film Growth

October 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
Superconformal electrodeposition of copper is explained by the recently developed curvature enhanced accelerator coverage (CEAC) mechanism. The model stipulates that 1. the growth velocity is proportional to the local accelerator, or catalyst, surface

Superconformal Electrodeposition of Silver in Submicrometer Features

August 1, 2002
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, John E. Bonevich, Monica D. Edelstein, D R Kelly, L Gan, Gery R. Stafford, P J. Chen, William F. Egelhoff Jr., Daniel Josell
The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyanide

Electrodeposition of Silver in Sub-Micron-Sized Features

February 1, 2002
Author(s)
B C. Baker, Thomas P. Moffat, Daniel Josell, Daniel Wheeler
Successful superfilling of lines and vias will be shown with a commercial, silver-cyanide electrolyte. Hysteretic i-V behavior and chronoamperometric transients on planar electrodes are used to extract parameters that quantify the kinetics of the

Superconformal Deposition by Surfactant-Catalyzed Chemical Vapor Deposition

January 24, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
The curvature enhanced accelerator coverage (CEAC) mechanism recently proposed to explain superconformal filling of fine trenches during copper electrodeposition is shown to also explain superconformal filling and roughness evolution during iodine

Superconformal Electrodeposition in Vias

January 1, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator coverage mechanism to model the effect of accelerator accumulation and area change on local copper deposition rate. Superconformal

Prediction of Lateral and Normal Force-Displacement Curves for Flipchip Solder Joints

September 1, 2001
Author(s)
Daniel Wheeler, Daniel Josell, James A. Warren, William E. Wallace
We present the results of experiments and modeling of flip-chip geometry solder joint shapes under shear loading. Modeling, using Surface Evolver, included development of techniques that use an applied vector force (normal and shear loading) as input to

Superconformal Electrodeposition in Submicron Features

July 1, 2001
Author(s)
Daniel Josell, Daniel Wheeler, W H. Huber, Thomas P. Moffat
Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local