U.S. flag

An official website of the United States government

Official websites use .gov
A .gov website belongs to an official government organization in the United States.

Secure .gov websites use HTTPS
A lock ( ) or https:// means you’ve safely connected to the .gov website. Share sensitive information only on official, secure websites.

Search Publications by: Christina Hacker (Fed)

Search Title, Abstract, Conference, Citation, Keyword or Author
Displaying 51 - 75 of 86

Switching in Flexible Titanium Oxide Memristors

June 25, 2010
Author(s)
Joseph L. Tedesco, Nadine E. Gergel-Hackett, Laurie A. Stephey, Christina A. Hacker, Curt A. Richter
In this study, memristors were fabricated on flexible polyethylene terephthalate (PET) substrates with aluminum contacts and a titanium dioxide film formed with a sol-gel of titanium isopropoxide and ethanol. To study the electric field dependence of

Metrology of Molecular Devices made by Flip Chip Lamination

April 30, 2010
Author(s)
Christina A. Hacker, Mariona Coll Bau, Curt A. Richter
Scaling of conventional electronics has continued unabated to dimensions approaching fundamental physical limits. As technology continues to evolve there are increasing demands to identify alternate routes of performing electrical functions. One potential

Flip Chip Lamination Approach to Fabricate Top Metal Contacts on Organic-based Devices

March 15, 2010
Author(s)
Mariona Coll Bau, Oana Jurchescu, Nadine Gergel-Hackett, Curt A. Richter, Christina Hacker
Flip Chip Lamination approach to fabricate top metal contacts on organic-based devices ; M.Coll, O.D. Jurchescu, N. Gergel-Hackett, C.A. Richter, C,A, Hacker, American Physical Society (APS), March 2010, Portland, OR, USA (oral)

Nanoelectronic Fabrication with Flip Chip Lamination

December 15, 2009
Author(s)
Mariona Coll Bau, Curt A. Richter, Christina Hacker
Nanoelectronic fabrication with Flip chip lamination Mariona Coll, CA Richter, CA Hacker, Colloquium Catalan Institute of Nanoscience and Nanotechnology CIN2, Barcelona Spain, Dec 2009.

Thermal Stability of Confined Flip-Chip Laminated w-Functionalized Monolayers

December 3, 2009
Author(s)
Mariona Coll Bau, Curt A. Richter, Christina A. Hacker
We present the results of an IR study of the effect of temperature on the formation of Au-monolayer-Si molecular junctions by using a flip-chip lamination approach. Carboxylic acid-terminated alkanethiols self-assembled on ultrasmooth gold substrate have

Fabrication with Flip-Chip Lamination

November 15, 2009
Author(s)
Mariona Coll Bau, Curt A. Richter, Christina Hacker
Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, Nanotechnology colloquium, Wake Forest University, 11-09.

Fabrication with Flip-Chip Lamination

October 15, 2009
Author(s)
Mariona Coll Bau, Curt A. Richter, Christina Hacker
Fabrication with Flip-Chip Lamination , Mariona Coll, DR Hines, CA Richter, CA Hacker, MRSEC surface physics colloquium, University of Maryland, College Park, 10-09.

Formation of Silicon-Based Molecular Electronic Structures Using Flip-chip Lamination

August 11, 2009
Author(s)
Mariona Coll Bau, Lauren H. Miller, Lee J. Richter, Daniel R. Hines, Curt A. Richter, Christina A. Hacker
The use of organic molecules to impart electrical surface properties has been a subject of intense research not only from a fundamental perspective but for many technological applications. In particular, organic molecules have been proposed as active

Flexible Solution-Processed Memristors

June 3, 2009
Author(s)
Nadine E. Gergel-Hackett, Behrang H. Hamadani, B Dunlap, John S. Suehle, Curt A. Richter, Christina A. Hacker, David J. Gundlach
We have fabricated physically flexible nonvolatile memory devices using inexpensive, room-temperature, solution processing. The behavior of these devices is consistent with that of a memristor device, the missing fourth circuit element theoretically

Ultrasmooth Gold as a Top Metal Electrode for Molecular Electronic Devices

April 7, 2009
Author(s)
Mariona Coll Bau, Christina A. Hacker, Lauren H. Miller, Daniel R. Hines, E. C. Williams, Curt A. Richter
In the emerging area of molecular electronics, fabrication of reliable metallic contacts remains one of the most critical challenges. Nanotransfer printing (nTP) is an attractive low-cost non-destructive technique to provide contact to organic monolayers

The Integration of Molecular Electronic Devices with Traditional CMOS Technologies

August 28, 2008
Author(s)
Nadine E. Gergel-Hackett, Askia A. Hill, Christina A. Hacker, Curt A. Richter
This work describes the development of hybrid circuits composed of silicon-based molecular electronic devices and traditional CMOS technology. In the development of these circuits, we first fabricated individual CMOS-compatible molecular electronic devices

Molecule induced interface states dominate charge transport in Si-alkyl-metal junctions

August 26, 2008
Author(s)
Lam H. Yu, Nadine E. Gergel-Hackett, Christopher D. Zangmeister, Christina A. Hacker, Curt A. Richter, James G. Kushmerick
Abstract. Semiconductor-molecule-metal junctions consisting of alkanethiol mono- layers self-assembled on both p+ and n¡ type highly doped Si(111)wires contacted with a 10 ¹m Au wire in a crossed-wire geometry are examined. Low temperature transport

Probing molecules in integrated solid-state silicon junctions

January 12, 2008
Author(s)
Wenyong Wang, Adina Scott, Nadine Gergel-Hackett, Christina Hacker, David Janes, Curt A. Richter
In this research work, we fabricate integrated Si-SAMs-metal devices using the ?soft? top metal deposition technique and probe their electronic properties with IETS characterizations. IETS confirmed the existence of molecular species in the device area.

The Characterization of Silicon-Based Molecular Devices

September 30, 2007
Author(s)
Nadine Gergel-Hackett, Christina Hacker, Lee J. Richter, Oleg A. Kirillov, Curt A. Richter
In order to realize molecular electronic (ME) technology, an intermediate integration with more traditional silicon-based technologies will likely be required. However, there has been little effort to develop the metrology needed to enable the fabrication

On-Chip Characterization of Molecular Electronic Devices using CMOS: The Design and Simulation of a Hybrid Circuit Based on Experimental Molecular Electronic Device Results

March 11, 2007
Author(s)
Nadine Gergel-Hackett, Garrett S. Rose, Pater Paliwoda, Christina Hacker, Curt A. Richter
The focus of the field of molecular electronics in recent years has been mostly limited to the development of molecular electronic test devices and the characterization of electron transport through organic molecules. However, in order for molecular