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SRI 6006 Precision Micro-machined Apertures

Technical Contact: nathan.tomlin [at] nist.gov (Nathan Tomlin)

Precision micro-machined apertures are fabricated from silicon on insulator (SOI) wafers. Lithographic processing allows great flexibility in the aperture design, enabling precise placement of apertures, through holes, and chip outlines. Optionally, metal can be deposited for low emissivity and multiwall vertically-aligned carbon nanotubes can be grown for high emissivity.

Specifications Certificate  (PDF format)

Standard Configurations

To obtain a quote for the instrument and calibration services, please contact Sales and Customer Service by email at srminfo [at] nist.gov (srminfo[at]nist[dot]gov (link sends e-mail)).

Aperture area measurements can be performed separately.

 

6006aPrecision aperture(s), 8 µm –12 µm thick aperture, no metal coating, 76.2 mm SOI wafer 
6006bPrecision aperture(s), 8 µm – 12 µm thick aperture, metal coating on aperture/front side, 76.2 mm SOI wafer 
6006cMicro-machined silicon aperture coated with metal on both sidesDiscontinued
6006dMicro-machined silicon aperture coated with metal and vertically-aligned carbon nanotubes on one sideDiscontinued
6006ePrecision aperture(s), 200 nm – 1000 nm thick aperture, no metal coating, 76.2 mm SOI wafer 
6006fPrecision aperture(s), 200 nm – 1000 nm thick aperture, metal coating on aperture/front side, 76.2 mm SOI wafer 
6006gAperture(s), 300 µm – 500 µm thick through holes, vertically-aligned carbon nanotubes on one side, 76.2 mm SOI wafer 
6006hPrecision aperture(s), 8 µm – 12 µm thick aperture, metal coating on aperture/front side, 150 mm SOI wafer 

 

Created September 28, 2016, Updated April 7, 2025