Technical Contact: nathan.tomlin [at] nist.gov (Nathan Tomlin)
Precision micro-machined apertures are fabricated from silicon on insulator (SOI) wafers. Lithographic processing allows great flexibility in the aperture design, enabling precise placement of apertures, through holes, and chip outlines. Optionally, metal can be deposited for low emissivity and multiwall vertically-aligned carbon nanotubes can be grown for high emissivity.
Specifications Certificate (PDF format)
Standard Configurations
To obtain a quote for the instrument and calibration services, please contact Sales and Customer Service by email at srminfo [at] nist.gov (srminfo[at]nist[dot]gov (link sends e-mail)).
Aperture area measurements can be performed separately.
6006a | Precision aperture(s), 8 µm –12 µm thick aperture, no metal coating, 76.2 mm SOI wafer | |
6006b | Precision aperture(s), 8 µm – 12 µm thick aperture, metal coating on aperture/front side, 76.2 mm SOI wafer | |
6006c | Micro-machined silicon aperture coated with metal on both sides | Discontinued |
6006d | Micro-machined silicon aperture coated with metal and vertically-aligned carbon nanotubes on one side | Discontinued |
6006e | Precision aperture(s), 200 nm – 1000 nm thick aperture, no metal coating, 76.2 mm SOI wafer | |
6006f | Precision aperture(s), 200 nm – 1000 nm thick aperture, metal coating on aperture/front side, 76.2 mm SOI wafer | |
6006g | Aperture(s), 300 µm – 500 µm thick through holes, vertically-aligned carbon nanotubes on one side, 76.2 mm SOI wafer | |
6006h | Precision aperture(s), 8 µm – 12 µm thick aperture, metal coating on aperture/front side, 150 mm SOI wafer |