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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 151 - 165 of 165

Electrodeposition of Silver in Sub-Micron-Sized Features

February 1, 2002
Author(s)
B C. Baker, Thomas P. Moffat, Daniel Josell, Daniel Wheeler
Successful superfilling of lines and vias will be shown with a commercial, silver-cyanide electrolyte. Hysteretic i-V behavior and chronoamperometric transients on planar electrodes are used to extract parameters that quantify the kinetics of the

Vibrational Signatures of Polyethylene Glycol and Brighteners on Copper

February 1, 2002
Author(s)
B C. Baker, Clayton S. Yang, Lee J. Richter, Thomas P. Moffat
With the use of fourier transform infrared spectroscopy (FTIR) and sum frequency generation spectroscopy (SFG), the surface coverage and confirmation of additives often used in copper deposition are identified on copper surfaces. Ex situ experiments at

Superconformal Deposition by Surfactant-Catalyzed Chemical Vapor Deposition

January 24, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
The curvature enhanced accelerator coverage (CEAC) mechanism recently proposed to explain superconformal filling of fine trenches during copper electrodeposition is shown to also explain superconformal filling and roughness evolution during iodine

Superconformal Electrodeposition in Vias

January 1, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator coverage mechanism to model the effect of accelerator accumulation and area change on local copper deposition rate. Superconformal

Ballistic Magnetoresistance in a Nanocontact Between a Ni Cluster and a Magnetic Thin Film

October 1, 2001
Author(s)
M Munoz, G G. Qian, N Karar, H. Cheng, I G. Saveliev, N Garcia, Thomas P. Moffat, P J. Chen, L Gan, William F. Egelhoff Jr.
We present measurements of ballistic magnetoresistance in nanocontacts grown by electrodeposition of Ni microclusters on magnetic thin films covered by aluminum oxide layers, using a technique proposed by Schad, et al. The measurements are made on a single

Superconformal Electrodeposition in Submicron Features

July 1, 2001
Author(s)
Daniel Josell, Daniel Wheeler, W H. Huber, Thomas P. Moffat
Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

Cu Electrodeposition for On-Chip Interconnections

January 1, 2001
Author(s)
Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky
The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the

Superconformal Electrodeposition of Copper in 500-90 nm Features

December 1, 2000
Author(s)
Thomas P. Moffat, Daniel Wheeler, W H. Huber, Daniel Josell
Superconformal electrodeposition of copper in 500 nm deep trenches ranging from 500 to 90 nm in width has been demonstrated using an acid cupric sulfate electrolyte containing chloride (C1), polyethylene glycol (PEG), and 3-meracapto- 1propanesulfonate

Sum Frequency Spectroscopy Studies of Adsorption of Additives on Metal/Electrolyte Interfaces

November 1, 2000
Author(s)
Clayton S. Yang, Lee J. Richter, Kimberly Briggman, John C. Stephenson, Thomas P. Moffat, Gery R. Stafford
In situ and ex situ VR-SFG studies of mercaptopropylsulfonate (MPSA) molecules adsorbed on metal/electrolyte interfaces prove the molecular conformation is sensitive to hydration. MPSA catalyses electrodeposition of copper interconnection for semiconductor

Structural and Magnetic Properties of Electrodeposited Co/Cu Multilayers

March 1, 1999
Author(s)
M Shima, L Salamanca-Riba, Thomas P. Moffat, Robert D. McMichael
A series of [Co(x ML)/Cu(17 ML)]100 multilayers were electrodeposited on Si(0 0 1) substrates covered with Cu seed layers. Magnetic hysteresis loops for lms with x 2 ML have sigmoidal shapes and the temperature dependence indicates a superparamagnetic

Compatibility of Halon Alternatives During Storage

August 21, 1994
Author(s)
Richard G. Gann, Carlos R. Beauchamp, Thomas G. Cleary, J L. Fink, Richard H. Harris Jr., F Horkay, G B. McKenna, Thomas P. Moffat, Marc R. Nyden, Richard D. Peacock, Richard E. Ricker, Mark R. Stoudt, W. K. Waldron
A key facet of the evaluation of new fire suppressants is their behavior under pressure and at elevated temperature in a metal storage container with an elastomer seal. In this study, 13 candidate chemicals have been examines: C2F6, C3F8, C4F10, cyclo-C4F8