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Search Publications by: Thomas P. Moffat (Fed)

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Displaying 126 - 150 of 165

Artifacts in Ballistic Magnetoresistance Measurements

June 1, 2004
Author(s)
William F. Egelhoff Jr., L Gan, H Ettedgui, Y Kadmon, Cedric J. Powell, P J. Chen, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles, Erik B. Svedberg
We have studied the behavior of electrodeposited Ni and Fe nanocontacts in magnetic fields and the changes in resistivity (Δ}R) that occur. Metallic particles suspended in plating solution, created and collected from the electroplating bath of a

Artifacts in Ballistic Magnetoresistance Measurements

June 1, 2004
Author(s)
William F. Egelhoff Jr., L Gan, H Ettendgui, Y Kadmon, Cedric J. Powell, P J. Chen, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles
We have carried out an extensive search for credible evidence to support the existence of a ballistic magnetoresistance (BMR) effect in magnetic nanocontacts. We have investigated both thin-film and thin-wire geometries for both mechanically-formed and

Superconformal Deposition and the CEAC Mechanism

February 27, 2004
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
The mechanism and modeling of superconformal film growth used in the electrochemical fabrication of 3-D Cu interconnects is briefly reviewed. The central role of electrolyte additives in controlling feature filling is fully described by the curvature

An Exact, Algebraic Solution for the Incubation Period of Superfill

January 1, 2004
Author(s)
Daniel Josell, Thomas P. Moffat, Daniel Wheeler
Recent publications have used the impact of area change coupled with conservation of adsorbed catalyst to quantify the superfill effect of bottom-up feature filling during electrodeposition and chemical vapor deposition. This work describes how that

Artifacts that mimic ballistic magnetoresistance

January 1, 2004
Author(s)
William F. Egelhoff Jr., L Gan, Erik B. Svedberg, Cedric J. Powell, Alexander J. Shapiro, Robert McMichael, J Mallett, Thomas P. Moffat, Mark D. Stiles
We have investigated the circumstances underlying recent reports of very large values of ballistic magnetoresistance (BMR) in nanocontacts between magnetic wires. We find that the geometries used are subject to artifacts due to motion of the wires that

Resistance Changes Similar to Ballistic Magnetoresistance in Electrodeposited Nanocontacts

January 1, 2004
Author(s)
J Mallett, Erik B. Svedberg, H Ettedgui, Thomas P. Moffat, Alexander J. Shapiro, P J. Chen, L Gan
We have devloped an electrochemical system to allow the resistance of two metal microelectrodes grown to contact to be established and maintained automatically. A thin-film geometry was used for the microelectrodes to suppress the magnetoresistive artifact

Structure and Magnetic Properties of Electrodeposition Co on n-GaAs (001)

September 19, 2003
Author(s)
A X. Ford, John E. Bonevich, Robert D. McMichael, Mark D. Vaudin, Thomas P. Moffat
Co thin films have been electrodeposited on n-type (001) GaAs. The structure and texture of the films were investigated using x-ray diffraction (XRD) and transmission electron microscopy (TEM) while the magnetic properties were examined using a vibrating

Seedless Superfill: Copper Electrodeposition in Trenches with Ruthenium Barriers

August 4, 2003
Author(s)
Daniel Josell, Daniel Wheeler, C Witt, Thomas P. Moffat
Superconformal filling of fine trenches during electrodeposition of copper is described. Copper electrodeposition was accomplished durectly on a ruthenium layer. The ruthenium layer, as well as a titanium layer to promote adhesion, was evaporated on

Influence of a Catalytic Surfactant on Roughness Evolution During Film Growth

July 24, 2003
Author(s)
Daniel Wheeler, Thomas P. Moffat, Geoffrey B. McFadden, Sam R. Coriell, Daniel Josell
celerator Coverage (CEAC) based mechanism for the impact of additives on the evolution of surface roughness is explained; the CEAC mechanism accounts for the conservation of locl coverage of adsorbed catalyst on a deforming interface. It has recently been

Modeling Superconformal Electrodeposition Using the Level Set Method

May 1, 2003
Author(s)
Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Superconformal filling (superfill) occurs when a high aspect ratio feature on a silicon wafer fills due to preferential metal deposition on the bottom surface that permits it to escape before deposition on the side walls causes them to close off. This

Superconformal Silver Deposition using KSeCn Derivatized Substrates

May 1, 2003
Author(s)
B C. Baker, C Witt, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Superconformal filling of sub-micrometer trenches was achieved using substrates that were catalyzed with KSeCn prior to metal deposition in a catalyst-free, silver-cyanide electrolyte. The degree of superfill was found to be dependent on the time the

Interconnect Fabrication by Superconformal Iodine-Catalyzed Chemical Vapor

April 3, 2003
Author(s)
Daniel Josell, S D. Kim, Daniel Wheeler, Thomas P. Moffat, S G. Pyo
The mechanism behind superconformal filling of fine features during surfactant catalyzed chemical vapor deposition is described and the metrology required to predict it is identified and quantified. The impact of adsorbed iodine coverage on copper

Accelerator Aging Effects During Copper Electrodeposition

April 1, 2003
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, Daniel Josell
Slow sweep rate voltammetric analysis of the Cu/Cu(II) deposition reaction is shown to be an effective tool for examining aging effects associated with thiol and disulfide additives that are widely employed as brighteners. Sulfonate-terminated short chain

Superconformal Electrodeposition of Silver from a KAg(CN) 2 -KCN-KSeCN Electrolyte

February 1, 2003
Author(s)
B C. Baker, M Freeman, B Melnick, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Electrodeposition of silver from a KAg(CN) 2-KCN electrolyte was investigated. The addition of potassium selenocyanate (KSeCN) results in a hysteretic current-voltage response, specular films and superconformal growth in submicrometer vias. These

A Mechanism for Brightening: Linear Stability Analysis of the Curvature Enhanced Coverage Model

January 6, 2003
Author(s)
Geoffrey B. McFadden, Sam R. Coriell, Thomas P. Moffat, Daniel Josell, Daniel Wheeler, W Schwarzacher
This work presents experiments and theory describing a mechanism for how brighteners in electrolytes function. The mechanism involves change of local coverage of a deposition rate enhancing catalyst adsorbed on the surface through change of local surface

Superconformal Electrodeposition Using Derivitized Substrates

December 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, C Witt, Daniel Josell
This paper demonstrates superconformal electrodeposition of copper in trenches using a two step process. The substrate is first derivitized with a submonolayer coverage of catalyst and then transferred for electroplating in a cupric sulfate electrolyte

Superconformal Film Growth

October 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
Superconformal electrodeposition of copper is explained by the recently developed curvature enhanced accelerator coverage (CEAC) mechanism. The model stipulates that 1. the growth velocity is proportional to the local accelerator, or catalyst, surface

Magnetic Properties of Ultrathin Laminated Co/Cu Films Prepared by Electrodeposition

September 1, 2002
Author(s)
M Shima, L Salamanca-Riba, Thomas P. Moffat, Robert D. McMichael
The magnetic properties of a series of electrodeposited [Co(x ML)/Cu(17 ML)]100 multilayers have been examined as a function of the cobalt layer thickness. The multilayers were grown on Si(100)covered with a highly textured Cu(100) seed alyer. Films with a

Superconformal Electrodeposition of Silver in Submicrometer Features

August 1, 2002
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, John E. Bonevich, Monica D. Edelstein, D R Kelly, L Gan, Gery R. Stafford, P J. Chen, William F. Egelhoff Jr., Daniel Josell
The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyanide