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Search Publications by: Daniel Josell (Fed)

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Displaying 101 - 125 of 135

Superconformal Electrodeposition of Silver from a KAg(CN) 2 -KCN-KSeCN Electrolyte

February 1, 2003
Author(s)
B C. Baker, M Freeman, B Melnick, Daniel Wheeler, Daniel Josell, Thomas P. Moffat
Electrodeposition of silver from a KAg(CN) 2-KCN electrolyte was investigated. The addition of potassium selenocyanate (KSeCN) results in a hysteretic current-voltage response, specular films and superconformal growth in submicrometer vias. These

A Mechanism for Brightening: Linear Stability Analysis of the Curvature Enhanced Coverage Model

January 6, 2003
Author(s)
Geoffrey B. McFadden, Sam R. Coriell, Thomas P. Moffat, Daniel Josell, Daniel Wheeler, W Schwarzacher
This work presents experiments and theory describing a mechanism for how brighteners in electrolytes function. The mechanism involves change of local coverage of a deposition rate enhancing catalyst adsorbed on the surface through change of local surface

Superconformal Electrodeposition Using Derivitized Substrates

December 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, C Witt, Daniel Josell
This paper demonstrates superconformal electrodeposition of copper in trenches using a two step process. The substrate is first derivitized with a submonolayer coverage of catalyst and then transferred for electroplating in a cupric sulfate electrolyte

Superconformal Film Growth

October 1, 2002
Author(s)
Thomas P. Moffat, Daniel Wheeler, Daniel Josell
Superconformal electrodeposition of copper is explained by the recently developed curvature enhanced accelerator coverage (CEAC) mechanism. The model stipulates that 1. the growth velocity is proportional to the local accelerator, or catalyst, surface

Superconformal Electrodeposition of Silver in Submicrometer Features

August 1, 2002
Author(s)
Thomas P. Moffat, B C. Baker, Daniel Wheeler, John E. Bonevich, Monica D. Edelstein, D R Kelly, L Gan, Gery R. Stafford, P J. Chen, William F. Egelhoff Jr., Daniel Josell
The generality of the curvature enhanced accelerator coverage (CEAC) model of superconformal electrodeposition is demonstrated through application to superconformal filling of fine trenches during silver deposition from selenium-catalyzed silver cyanide

Apparatus to Measure Wafer Curvature for Multilayer Systems in a Vacuum Furnace

April 1, 2002
Author(s)
A B. Mann, J Tapson, D van Heerden, A C. Lewis, Daniel Josell, Timothy P. Weihs
A laser-based technique for measuring the curvature of a multilayer/substrate couple is described. Unlike most wafer curvature systems, the instrument described measures the local curvature of the multilayer/substrate couple, correcting for the local

Electrodeposition of Silver in Sub-Micron-Sized Features

February 1, 2002
Author(s)
B C. Baker, Thomas P. Moffat, Daniel Josell, Daniel Wheeler
Successful superfilling of lines and vias will be shown with a commercial, silver-cyanide electrolyte. Hysteretic i-V behavior and chronoamperometric transients on planar electrodes are used to extract parameters that quantify the kinetics of the

Superconformal Deposition by Surfactant-Catalyzed Chemical Vapor Deposition

January 24, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
The curvature enhanced accelerator coverage (CEAC) mechanism recently proposed to explain superconformal filling of fine trenches during copper electrodeposition is shown to also explain superconformal filling and roughness evolution during iodine

Superconformal Electrodeposition in Vias

January 1, 2002
Author(s)
Daniel Josell, Daniel Wheeler, Thomas P. Moffat
Conditions for which superconformal filling of vias can be expected are predicted using the curvature enhanced accelerator coverage mechanism to model the effect of accelerator accumulation and area change on local copper deposition rate. Superconformal

Prediction of Lateral and Normal Force-Displacement Curves for Flipchip Solder Joints

September 1, 2001
Author(s)
Daniel Wheeler, Daniel Josell, James A. Warren, William E. Wallace
We present the results of experiments and modeling of flip-chip geometry solder joint shapes under shear loading. Modeling, using Surface Evolver, included development of techniques that use an applied vector force (normal and shear loading) as input to

Moving the Pulsed Heating Technique Beyond Monolithic Specimens: Experiments with Coated Wires

August 1, 2001
Author(s)
Daniel Josell, D Basak, J L. McClure, Ursula R. Kattner, Maureen E. Williams, William J. Boettinger, M Rappaz
Pulsed heating experiments based on pyrometric measurement of the temperature-time history of metal specimens rapidly heated by passage of electric current have a thirty year history at NIST. In recent years, efforts have been made to move beyond the

Superconformal Electrodeposition in Submicron Features

July 1, 2001
Author(s)
Daniel Josell, Daniel Wheeler, W H. Huber, Thomas P. Moffat
Superconformal electrodeposition is explained based on a local growth velocity that increases with coverage of a catalytic species adsorbed on the copper-electrolyte interface. For dilute concentration of the catalyst precursor in the electrolyte, local

Abstracts for the MSEL Assessment Panel, March 2001

January 26, 2001
Author(s)
Leslie E. Smith, Alamgir Karim, Leonid A. Bendersky, C Lu, J J. Scott, Ichiro Takeuchi, Kathleen M. Flynn, Vinod K. Tewary, Davor Balzar, G A. Alers, Stephen E. Russek, Charles C. Han, Haonan Wang, William E. Wallace, Daniel A. Fischer, K Efimenko, Wen-Li Wu, Jan Genzer, Joseph C. Woicik, Thomas H. Gnaeupel-Herold, Henry J. Prask, Charles F. Majkrzak, Norman F. Berk, John G. Barker, Charles J. Glinka, Eric K. Lin, Ward L. Johnson, Paul R. Heyliger, David T. Read, R R. Keller, J Blendell, Grady S. White, Lin-Sien H. Lum, Eric J. Cockayne, Igor Levin, C E. Johnson, Maureen E. Williams, Gery R. Stafford, William J. Boettinger, Kil-Won Moon, Daniel Josell, Daniel Wheeler, Thomas P. Moffat, W H. Huber, Lee J. Richter, Clayton S. Yang, Robert D. Shull, R A. Fry, Robert D. McMichael, William F. Egelhoff Jr., Ursula R. Kattner, James A. Warren, Jonathan E. Guyer, Steven P. Mates, Stephen D. Ridder, Frank S. Biancaniello, D Basak, Jon C. Geist, Kalman D. Migler
Abstracts relating to research and development in the NIST Materials Science and Engineering Laboratory (MSEL) are presented for a poster session to be presented to the 2001 MSEL Assessment Panel.

Cu Electrodeposition for On-Chip Interconnections

January 1, 2001
Author(s)
Gery R. Stafford, Thomas P. Moffat, V D. Jovic, David R. Kelley, John E. Bonevich, Daniel Josell, Mark D. Vaudin, N G. Armstrong, W H. Huber, A Stanishevsky
The electrochemical behavior of copper in copper sulfate - sulfuric acid, containing various combinations of NaCl, sodium 3 mercapto-1 propanesulfonate (MPSA), and polyethylene glycol (PEG) is examined. The i-E deposition characteristics of the

Superconformal Electrodeposition of Copper in 500-90 nm Features

December 1, 2000
Author(s)
Thomas P. Moffat, Daniel Wheeler, W H. Huber, Daniel Josell
Superconformal electrodeposition of copper in 500 nm deep trenches ranging from 500 to 90 nm in width has been demonstrated using an acid cupric sulfate electrolyte containing chloride (C1), polyethylene glycol (PEG), and 3-meracapto- 1propanesulfonate