Our group works to advance metrology and instrumentation for measuring mechanical, thermal and electrical properties, and thermodynamic behavior of bulk materials, thin films, and interfaces. We determine and disseminate key data to establish the relationship between structure, property, and performance of materials and devices to address current and future needs primarily in semiconductor microelectronics. We develop standards, reference materials, micro- and nanofabricated test devices, and analysis techniques for improving the metrological foundation of characterization methods, including X-ray diffraction, atomic force microscopy, spectroscopy- and diffraction-based strain measurements, atom probe tomography, 3D microscopy, and 3D profilometry.