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Funding Updates

$36 Billion+ in CHIPS for America Funding Announced

The bipartisan CHIPS and Science Act was signed into law on August 9, 2022 – creating a $52 billion investment to revitalize America’s domestic semiconductor industry and strengthen the country’s economic and national security. CHIPS for America within the U.S. Department of Commerce is responsible for administering $50 billion of the investments in semiconductor incentives and funding for research and development programs. The activities on this page continue the implementation phase of this bipartisan program to bring manufacturing jobs back to the United States, strengthen global supply chains, and secure America’s technology leadership in the 21st century.

Chips for America Awards

GlobalFoundries (Vermont) – Burlington, VT
Award Amount: $125 million in direct funding
CHIPS Organization
CHIPS Program Office
The CHIPS for America award will provide GlobalFoundries up to $125 million in total direct funding under the CHIPS and Science Act to support the revitalization of an existing fabrication facility that is expected to commercialize new 200 mm technologies, which would create the first U.S. facility capable of high-volume manufacturing of next-generation Gallium Nitride on Silicon for use in electric vehicles, power grid, 5G and 6G smartphones, and other critical technologies.
Infinera (California) – San Jose, CA
Award Amount: up to $93 million in proposed funding (split across Bethlehem, PA and San Jose, CA)
CHIPS Organization
CHIPS Program Office
The CHIPS for America investment would support the construction of a new, modernized fab and foundry with over 40,000 square feet of cleanroom space, which would increase its InP PIC manufacturing to meet future capacity and capability demands.
Corning (New York) – Canton, NY
Award Amount: up to $32 million in direct funding
CHIPS Organization
CHIPS Program Office
The CHIPS investment will enable Corning to increase production of High Purity Fused Silica (HPFS) and EXTREME ULE Glass (Ultra Low Expansion Glass) and scale a novel technology manufacturing process in Canton.

View all CHIPS for America Awards


CHIPS for America Proposed Funding

Analog Devices Inc. (Washington) – Camas, WA
Proposed Award Amount: up to $105 million in proposed funding (split across Chelmsford, MA, Beaverton, OR, and Camas, WA)
CHIPS Organization
CHIPS Program Office
CHIPS for America’s proposed investment in Washington would support the expansion of front-end mature node semiconductor manufacturing for devices used in a wide variety of applications, including but not limited to automotive, industrial, and defense applications.
Coherent (Pennsylvania) – Easton, PA
Proposed Award Amount: up to $79 million in proposed funding
CHIPS Organization
CHIPS Program Office
The proposed CHIPS investment would also support the expansion of the facility’s SiC epitaxial wafer manufacturing capacity, back-end of line processing, electronic performance, and reliability testing capabilities. SiC substrates are an important bandgap material with end uses in energy and military applications.
Analog Devices Inc. (Oregon) – Beaverton, OR
Proposed Award Amount: up to $105 million in proposed funding (split across Chelmsford, MA, Beaverton, OR, and Camas, WA)
CHIPS Organization
CHIPS Program Office
CHIPS for America’s proposed investment in Oregon would support the expansion of front-end mature node semiconductor manufacturing for devices used in a wide variety of applications, including but not limited to automotive, industrial, and defense applications.

View all CHIPS for America Proposed Funding


National Semiconductor Technology Center

The NSTC is operated by Natcast, a purpose-built, non-profit entity. Natcast works in tandem with the CHIPS NSTC Program, which sits within the Department of Commerce. Read more about the historic and long-lasting investments of NSTC, one of the CHIPS for America R&D Programs here.

CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility – Tempe, AZ
The CHIPS for America NSTC Prototyping and National Advanced Packaging Manufacturing Program (NAPMP) Advanced Packaging Piloting Facility (PPF), an NSTC and NAPMP facility, is expected to be located the Arizona State University (ASU) Research Park in Tempe, Arizona.
CHIPS for America Design and Collaboration Facility, an NSTC Facility – Sunnyvale, CA
The CHIPS for America Design and Collaboration Facility (DCF), an NSTC Facility, is expected to operate in Sunnyvale, California. The proposed facility will play an important role in advancing semiconductor design research, workforce development, investment, and collaboration across the entire semiconductor value chain.
CHIPS for America EUV Accelerator, an NSTC Facility – Albany, NY
Funded by Natcast: $825 million
The CHIPS for America Extreme Ultraviolet (EUV) Accelerator, an NSTC facility (EUV Accelerator), is expected to operate within NY CREATES’ Albany NanoTech Complex in Albany, New York. This proposed facility will bring together NSTC members from across the ecosystem to accelerate semiconductor R&D and innovation by providing NSTC members access to technologies, capabilities, and critical resources.

View all NSTC Funding

Created December 8, 2023, Updated January 23, 2025