CHIPS for America Awards

This CHIPS investment will help ensure a reliable domestic supply of important equipment needed for semiconductor manufacturing. This would be a meaningful step towards strengthening U.S. economic and national security, as currently, there is no domestic production of semiconductor-grade dry vacuum pumps.

The CHIPS for America award will provide GlobalFoundries up to $125 million in total direct funding under the CHIPS and Science Act to support the revitalization of an existing fabrication facility that is expected to commercialize new 200 mm technologies, which would create the first U.S. facility capable of high-volume manufacturing of next-generation Gallium Nitride on Silicon for use in electric vehicles, power grid, 5G and 6G smartphones, and other critical technologies.

The CHIPS for America investment would support the construction of a new, modernized fab and foundry with over 40,000 square feet of cleanroom space, which would increase its InP PIC manufacturing to meet future capacity and capability demands.

The CHIPS investment will enable Corning to increase production of High Purity Fused Silica (HPFS) and EXTREME ULE Glass (Ultra Low Expansion Glass) and scale a novel technology manufacturing process in Canton.

The CHIPS for America award will provide GlobalFoundries up to $1.45 billion in total direct funding under the CHIPS and Science Act to support the construction of a new, large-scale 300mm fabrication facility, the expansion and modernization of an existing fabrication facility, and the expansion of existing campus to provide advanced packaging technology not currently available in the U.S. It will also support the expansion of the existing Malta, New York fabrication facility, which includes a strategic agreement with General Motors, that is expected to secure a dedicated supply of essential semiconductor technologies.

The CHIPS for America investment would support the construction of a new, state-of-the-art advanced test and packaging facility focused on meeting the increasing demand for InP PICs.

This award supports Absolics Inc. in revolutionizing glass core panel manufacturing by developing cutting-edge capabilities through its Substrate and Materials Advanced Technology (SMART) Packaging Program.

The award will support Applied Materials in developing and scaling a disruptive silicon-core substrate technology for next-generation advances in packaging and 3D heterogeneous integration.

This award aims to support Arizona State University in developing the next generation of microelectronics packaging through fan-out-wafer-level processing and exploring the commercial vitality of 300mm wafer-level and 600mm panel-level manufacturing.

The CHIPS for America award will provide HP up to $53 million in total direct funding under the CHIPS and Science Act to support the expansion and modernization of HP’s existing facility in Corvallis, Oregon, which is part of the company’s “lab-to-fab” ecosystem in the region that spans from research and development (“R&D”) activities to commercial manufacturing operations.

The CHIPS for America award will provide Hemlock Semiconductor up to $325 million in total direct funding under the CHIPS and Science Act to support the construction of a new manufacturing facility on HSC’s existing campus in Hemlock, Michigan, dedicated to the production and purification of hyper-pure semiconductor-grade polysilicon.

The purpose of this award is to establish and operate a Manufacturing USA institute, known as SMART USA, focused on efforts to develop, validate, and use digital twins to improve domestic semiconductor design, manufacturing, advanced packaging, assembly, and test processing.

The CHIPS for America award will provide Samsung Austin, Texas up to $4.745 billion in total direct funding under the CHIPS and Science Act to support the expansion of a facility that has been an economic engine for Central Texas for nearly 30 years. This investment would expand the existing facilities to support the production of leading fully depleted silicon-on-insulator (FD-SOI) process technologies for critical U.S. industries, including aerospace, defense, and automotive. This investment also includes commitments to collaborate with the U.S. Department of Defense.

The CHIPS for America award will provide Amkor Technology Peoria, Arizona up to $900 million in total direct funding under the CHIPS and Science Act to support the construction of a new advanced packaging and testing facility ensuring a reliable domestic advanced packaging ecosystem, supporting leading-edge clusters, and helping meet the growing demand for AI chips.

The CHIPS for America award will provide Texas Instruments Lehi, Utah up to $700 million in total direct funding under the CHIPS and Science Act to support the construction of a new, large-scale 300-mm fabrication facility to produce 28nm – 65nm analog and embedded processing semiconductors, which is anticipated to produce tens of millions of chips every day. This project represents the largest economic investment in Utah’s history.